News

Media Coverage: Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

List of Media Publications Regarding the Press Release: "Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON"

Media Coverage: Elephantech and Logitech Together Drive Disruptive Electronics Innovation

（3BL CSRwire）Elephantech and Logitech Together Drive Disruptive Electronics Innovation （Yahoo! Finance）Elephantech and Logitech Together Drive Disruptive Electronics Innovation （gurufocus.com ） Logitech International SA (LOGI) Partners with Elephantech for Sustainable PCB Technology （ic-pcb.com）Elephantech’s Low-Carbon PCB ‘SustainaCircuits®’ Adopted for Mass Production in Logitech Mouse Press Release Elephantech and Logitech Together Drive Disruptive Electronics Innovation Med […]

Elephantech will be exhibiting at Automotive Engineering Exposition 2025 YOKOHAMA

Elephantech will be exhibiting at the Automotive Engineering Exposition 2025 YOKOHAMA from May 21 to May 23, 2025.

Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

Download April 22, 2025, Tokyo, Japan – Japanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing. As the first milestone of the new direction, Elephantech has signed its second Memorandum of Understanding (MoU) with Taiwan-based LITE-ON Technology Corporation (LITEON), deepening their strategic partnership in advancing environmentally responsibl […]

Elephantech and Logitech Together Drive Disruptive Electronics Innovation

today ann ounced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the PCB industry.

Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production

Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.

Golden Week Holiday Announcement

We would like to inform you of Elephantech’s Golden Week holiday schedule.

Elephantech to Sponsor and Exhibit at ICEP 2025

Through our sponsorship, we aim to actively support academic and technical discussions in electronics packaging and contribute to the advancement of sustainable electronic device manufacturing.

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025 from March 24 to 26, 2025.

Elephantech will exhibit at IPC APEX EXPO 2025

Elephantech will be exhibiting at IPC APEX EXPO 2025 in Anaheim, USA, March 18-20, 2025.

Elephantech will exhibit at MWC 2025

Elephantech will participate in MWC 2025, which will be held in Barcelona, Spain, from Monday, March 3 to Thursday, March 6, 2025, for four days.

[Media Coverage]DIGITIMES asia：AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors

Elephantech was featured in DIGITIMES Asia with an article titled “AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors.”

[Media Coverage] Latest Press Release Articles

The press release entitled “Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology“, which was distributed on December 17, 2024, was featured as an article in the following media outlets. ▶ SustainaCircuits: Japan’s Elephantech unveils general-purpose multilayer PCBs（DIGITIMES Asia） ▶ 日本Elephantech將噴墨印刷技術SustainaCircuits擴展至硬質多層電路板，能降低70%銅用量（cool3） ▶ 一PCB企业推出新产品, 可降低成本474亿, 覆盖78%市场（HNPCA） Media Coverage List of Media Articles

Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

We are pleased to announce that, due to several technological innovations, we have successfully developed general-purpose multilayer PCBs earlier than expected.

Developed adhesive coating technology for advanced packaging using high-precision inkjet technology

Elephantech has introduced an inkjet-based method for applying bonding materials essential for advanced packaging, such as those used in AI semiconductors.

FLEX Japan 2024 : Announcement of presentation

Our company’s co-founder, Masaaki Sugimoto, will be speaking at FLEX Japan 2024, held alongside SEMICON Japan 2024. We hope to see you there.

Exhibition at SEMICON Japan 2024

Elephantech will be exhibiting at SEMICON Japan 2024, which will be held at the Tokyo Big Sight from Wednesday, December 11 to Friday, December 13, 2024. SEMICON Japan 2024 Exhibition Information Exhibition SEMICON Japan 2024 Dates Wednesday, December 11 to Friday, December 13, 2024. Venue Tokyo Big Sight ( Access ) Booth Booth: 2028 Exhibitor Page EXHIBITOR DETAILS Elephantech’s inkjet technology Elephantech provides high-precision, high-productivity inkjet solutions through its 4th gener […]

Climate Hive Connect with Elephantech

At Climate Hive Connect, Satoshi Konagai, COO of Elephantech, delivered a presentation on the company’s groundbreaking sustainable printed circuit boards (PCBs).

TechBlick: Printed Electronics as sustainable solutions

A portion (the first five minutes) of our Board Director & Co-Founder Masaaki Sugimoto’s presentation at TechBlick has been released.

Elephantech will exhibit at electronica 2024.

Elephantech will be exhibiting at PCB West 2024, which will be held on Wednesday, October 9, 2024 at the Santa Clara Convention Center, CA USA. Don't miss to see Elephantech technology, please visit our booth!