Company
Company overview
- Company name
- Elephantech Inc.
- Established
- January 2014
- Headquarters
- 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
- Representative
- Shinya Shimizu, Representative Director / CEO / Co-Founder
- Capital
- 100 million JPY
- Number of employees
- 140
- Board of directors
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Representative Director
Shinya Shimizu
CEO Co-Founder, Elephantech Inc.
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Board director
Masaaki Sugimoto
Co-Founder, Elephantech Inc.
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Board director
Keisuke Ito
CFO, Elephantech Inc.
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External Director
Tomihisa Kamada
CEO, LPIXEL Inc.
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External Director
Kengo Ueha
Representative Director, Beyond Next Ventures
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External Director
Masahiro Sameshima
General Partner, ANRI
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Standing audit & supervisory member
Kazuyuki Takiguchi
Audit & Supervisory Board member, Elephantech Inc.
(Former Director of KPP GROUP HOLDINGS CO., LTD.) -
External audit & supervisory member
Hisako Takahashi
ZeLo, a Foreign Law Joint Enterprise - Attorney at Law
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External audit & supervisory member
Hideyuki Hashimoto
Outside director (Member of the Audit and Supervisory Committees) of Silver Life Co., Ltd.
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- Business description
- Development of printed electronics manufacturing technology and provision of related services
As of August 1, 2025
Team
Board of directors
Executive officers
Company history
2014
Founded as AgIC Inc. in Bunkyo-ku, Tokyo.
2016
Initiated technical validation of flexible printed circuits (FPCs) using inkjet printing technology.
2017
Launched sales of FPC, P-Flex™, made using proprietary Pure Additive™ processing.
Renamed the company to Elephantech Inc.
2018
Relocated headquarter to Chuo-ku, Tokyo and established a small-scale demonstration line.
Launched sales of polyimide-based FPC P-Flex™ PI.*1
2019
Formed alliances with Seiko Epson Corporation and Mitsui Chemicals, Inc.
Raised a total of 1.8 billion yen in funding.
2020
Established AMC Nagoya as Pure Additive™ PCB mass production site.
2022
AMC Nagoya obtained ISO 9001 and ISO 14001 certifications.
Established Shinkiba R&D Center.
2023
Achieved 3.9 billion yen fund-raising.
2024
Achieved 3 billion yen in total funding.
Unified P-Flex™ products and Pure Additive™ technology branding under the proprietary SustainaCircuits™ brand.
Launched ELP-04: a cutting-edge inkjet printing platform for industrial PCB manufacturing.
Successfully developed general-purpose multilayer PCBs powered by SustainaCircuits™.
2025
Established new business by launching SustainaCircuits™ multilayer PCB production solutions.
Introduced world-class innovations including expanding FPC specifications to support thin- and thick-copper designs and launching 15nm copper nano filler.
- *1PI stands for Polyimide, which is the base material for flexible substrates.