Company

Our mission

Making the world sustainable with new manufacturing technologies

Elephantech is a Japanese green tech startup that has succeeded in using metal inkjet printing technology to mass produce printed circuit boards (PCBs). Our additive manufacturing technologies are essential for achieving decarbonization and biodiversity in the electronics industry and we aim to establish a sustainable industry standard by continuing to scale these technologies.

Message from the CEO

Company overview

Company name
Elephantech Inc.
Established
January 2014
Headquarters
4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan Offices & locations
Representative
Shinya Shimizu, Representative Director & CEO
Capital
100 million JPY
Number of employees
139
Board of directors
  • Representative Director

    Shinya Shimizu

    CEO, Elephantech Inc.

  • Board director

    Masaaki Sugimoto

    Co-Founder, Elephantech Inc.

  • External Director

    Tomihisa Kamada

    CEO, LPIXEL Inc.

  • External Director

    Kengo Ueha

    Representative Director, Beyond Next Ventures

  • External Director

    Masahiro Sameshima

    General Partner, ANRI

  • Standing audit & supervisory member

    Kazuyuki Takiguchi

    Audit & Supervisory Board member, Elephantech Inc.
    (Former Director of KPP GROUP HOLDINGS CO., LTD.)

  • External audit & supervisory member

    Hisako Takahashi

    ZeLo, a Foreign Law Joint Enterprise - Attorney at Law

  • External audit & supervisory member

    Hideyuki Hashimoto

    Outside director (Member of the Audit and Supervisory Committees) of Silver Life Co., Ltd.

Business description
Development of printed electronics manufacturing technology and provision of related services

As of August 1, 2024

Team

Board of directors

Executive officers

History

2014

January

AgIC Inc. (now Elephantech Inc.) was established in Bunkyo-ku, Tokyo.

2016

February

Began technical validation of flexible substrates using inkjet printing technology.

2017

July

Started sales of flexible substrate P-Flex® printed circuit boards made using proprietary Pure Additive™ processing.

September

Changed the company name from "AgIC Inc." to "Elephantech Inc."

2018

January

Relocated headquarters from Bunkyo-ku to Chuo-ku, Tokyo, and established a small-scale demonstration line within headquarters.

July

Started sales of polyimide-based flexible susbstrate P-Flex PI® printed circuit boards.*1

2019

February

Headquarters obtained ISO 9001 and ISO 14001 certification.

July

Formed a capital and business alliance with Seiko Epson Corporation.

October

Formed a strategic alliance with Mitsui Chemicals, Inc.

November

A total of 1.8 billion yen was raised from Seiko Epson Corporation, Mitsui Chemicals, Inc., Sumitomo Corporation, and others.

2020

April

Established AMC Nagoya (Additive Manufacturing Center) as a mass production demonstration site and factory.

October

Reached a basic agreement with Nisshinbo Mechatronics on the development of molded parts for ADAS-equipped vehicles using IMPC® technology*2.

2021

January

Began large-scale mass production of P-Flex PI® PI at AMC Nagoya.

October

Obtained UL certification for P-Flex PI® produced at AMC Nagoya

2022

January

AMC Nagoya obtained ISO 9001 and ISO 14001 certification.

May

Established the Shinkiba R&D Center as a research and development base.

2023

August

Introduced a self-developed large-scale mass production inkjet printing machine at AMC Nagoya.

November

Signed a Memorandum of Understanding (MoU) with LITE-ON Technology Corporation to promote the mass production of low-carbon printed circuit boards.

2024

May

Announced NeuralJet™ high-precision inkjet manufacturing technology that uses AI.

  • *1PI stands for Polyimide, which is the base material for flexible substrates.
  • *2In-Mold Printed Circuit: A technology that integrates resin products and electronic circuits, providing electrical functionality to the resin products.

Learn about our company culture

The Elephantech way