Company
Company overview
- Company name
- Elephantech Inc.
- Established
- January 2014
- Headquarters
- 4-3-8 Hatchobori, Chuo-ku, Tokyo 104-0032, Japan
- Representative
- Shinya Shimizu, Representative Director / CEO / Co-Founder
- Capital
- 100 million JPY
- Number of employees
- 144
- Board of directors
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Representative Director
Shinya Shimizu
CEO Co-Founder, Elephantech Inc.
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Board director
Keisuke Ito
CFO, Elephantech Inc.
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External Director
Tomihisa Kamada
CEO, LPIXEL Inc.
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External Director
Kengo Ueha
Representative Director, Beyond Next Ventures
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External Director
Masahiro Sameshima
General Partner, ANRI
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Standing audit & supervisory member
Kazuyuki Takiguchi
Audit & Supervisory Board member, Elephantech Inc.
(Former Director of KPP GROUP HOLDINGS CO., LTD.) -
External audit & supervisory member
Hisako Takahashi
ZeLo, a Foreign Law Joint Enterprise - Attorney at Law
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External audit & supervisory member
Hideyuki Hashimoto
Outside director (Member of the Audit and Supervisory Committees) of Silver Life Co., Ltd.
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- Business description
- Development of printed electronics manufacturing technology and provision of related services
As of September, 2025
Team
Board of directors
Executive officers
Company history
2014
Founded as AgIC Inc. in Bunkyo-ku, Tokyo.
2016
Initiated technical validation of flexible printed circuits (FPCs) using inkjet printing technology.
2017
Launched sales of FPC, P-Flex™, made using proprietary Pure Additive™ processing.
Renamed the company to Elephantech Inc.
2018
Relocated headquarter to Chuo-ku, Tokyo and established a small-scale demonstration line.
Launched sales of polyimide-based FPC P-Flex™ PI.*1
2019
Formed alliances with Seiko Epson Corporation and Mitsui Chemicals, Inc.
Raised a total of 1.8 billion yen in funding.
2020
Established AMC Nagoya as Pure Additive™ PCB mass production site.
2022
AMC Nagoya obtained ISO 9001 and ISO 14001 certifications.
Established Shinkiba R&D Center.
2023
Achieved 3.9 billion yen fund-raising.
2024
Achieved 3 billion yen in total funding.
Unified P-Flex™ products and Pure Additive™ technology branding under the proprietary SustainaCircuits™ brand.
Launched ELP-04: a cutting-edge inkjet printing platform for industrial PCB manufacturing.
Successfully developed general-purpose multilayer PCBs powered by SustainaCircuits™.
2025
Established new business by launching SustainaCircuits™ multilayer PCB production solutions.
Introduced world-class innovations including expanding FPC specifications to support thin- and thick-copper designs and launching 15nm copper nano filler.
- *1PI stands for Polyimide, which is the base material for flexible substrates.