News

Elephantech Develops DeepVia™ Silicon: A High-Aspect-Ratio Seed Layer Solution for 3D Semiconductor IntegrationA Novel Approach for Silicon Via Seed Layer Formation Addressing Increasing Aspect Ratios

Elephantech has developed a novel approach for forming copper seed layers in high-aspect-ratio (AR) silicon vias, utilizing proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3:1 to Advance AI computing

Elephantech announced the successful development of DeepVia™ HDI, a high-aspect-ratio microvia metallization solution based on its proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die AttachLow-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Inc. today announced the successful development of SAphire™ D, a low-temperature sintering copper nanopaste, based on its proprietary Self-Assembling Copper Nanoparticles (SA-CuNP) technology. The new paste is designed for next-generation power semiconductor die attach process.

Elephantech Announces Investment from Mitsubishi Electric and Strategic Partnership to Accelerate Global Deployment of SustainaCircuits

Elephantech has secured a JPY 4 billion investment from Mitsubishi Electric and entered into a strategic partnership.

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle InkA Novel Solution for High-Density Board Manufacturing

Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”

Elephantech Announces First Sale of ELP04 PILOT 600R, Accelerating Transformation of PCB Manufacturing

Elephantech announced the sale of the first unit of ELP04 PILOT 600R, the latest model in its ELP04 advanced inkjet equipment series.

Elephantech Launches Copper-on-Copper Self-Assembling NanoparticlesUnlocking New Possibilities in Semiconductor Packaging Materials

Elephantech announced the successful development of Self-Assembling Copper Nanoparticles, a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.

Elephantech selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field

Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.

Elephantech Launches World’s Smallest-Class Copper Nanofiller

Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller—the smallest class available globally.

Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon printed circuit board manufacturing.

Elephantech and Logitech Together Drive Disruptive Electronics Innovation

Elephantech announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the PCB industry.

Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production

Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.

Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

We are pleased to announce that, due to several technological innovations, we have successfully developed general-purpose multilayer PCBs earlier than expected.

Elephantech announces new sustainable industrial printer

Japanese green tech innovator Elephantech today announced the release of their new industrial inkjet printing platform, the ELP04.

Announcing NeuralJet™: High-precision inkjet manufacturing technology using AI

Elephantech introduces NeuralJet, an AI-powered high-precision inkjet manufacturing technology.

Elephantech secures 3 billion yen in Series E financing.

Elephantech Inc. has raised around 3 billion yen in its Series E financing.

Elephantech Benefits from Startup Debt Guarantee Scheme
to Sign Loan Agreement Totaling 2 Billion Yen

Elephantech Inc is pleased to announce that it has recently signed a loan agreement for a total of two billion yen by utilizing the Innovative Technology Research Results Utilization Facilitation Debt Guarantee System provided by the Independent Administrative Institution, Organization for Small & Medium Enterprises and Regional Innovation, JAPAN .

Elephantech and LITEON Technology Partner for Innovative Technology and a Sustainable Future

Elephantech Inc. is excited to announce that Elephantech has signed a new Memorandum of Understanding (MoU) with LITE-ON Technology Corporation (LITEON), a global leading tech company headquartered in Taiwan, to promote the mass production of low-carbon Printed Circuit Boards (PCB).

Elephantech raised funds through third-party allotment of new shares.Raised 3.9 billion yen through Series D financing, Total amount raised since inception is approximately 10 billion yen

Elephantech raised funds through third-party allotment of new shares. - Raised 3.9 billion yen through Series D financing,Total amount raised since inception is approximately 10 billion yen-

Our CEO, Shinya Shimizu named as one of the 2023 Meaningful Business 100

CEO Shimizu has been named as one of this year’s MB100, among a global group of leaders combining profit and purpose to tackle the world’s most pressing issues.