News

Elephantech Has Developed SAphire™ B: A Low-Resistance Copper Nanopaste for Inter-Board Connections in High-Layer-Count PCBsAchieves High Reliability Through Low-Temperature Sintering in Ambient Atmosphere

Elephantech announced SAphire™ B, a copper nanopaste designed for inter-board connections in advanced multilayer PCBs.

Elephantech Introduces DS-SAP™ for Fine Patterning on Semiconductor Package SubstratesDual-Seed Technology Enables Higher Density for Advanced AI Packaging

Elephantech has developed DS-SAP™, a novel process for semiconductor package substrates manufacturing. Through independently forming seed layers for surface patterning and via metallization, DS-SAP™ achieves both ultra-thin traces and reliable coverage of high-aspect-ratio vias.

Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech announces the development of SAphire™ D02, a new addition to its SAphire™ low-temperature sintering copper nano-paste lineup, designed for pressureless die attach applications.

Elephantech Joins UCLA CHIPS

Elephantech has joined the Center for Heterogeneous Integration and Performance Scaling (CHIPS), a university-industry consortium at the University of California, Los Angeles (UCLA).

Join Elephantech CEO Shinya Shimizu at an IEEE Webinar

On August 6, 2026(PT), Shinya Shimizu, Founder and CEO of Elephantech, will present at a webinar hosted by the IEEE Electronics Packaging Society (EPS) Santa Clara Valley Chapter, an IEEE chapter dedicated to electronics packaging and assembly technologies.

Exhibiting at JPCA Show 2026

Elephantech will be exhibiting at JPCA Show 2026, one of Asia’s leading international exhibitions for the electronics industry. In addition to our own booth, we will also participate in a joint exhibition with our business partner Mitsubishi Electric.

Elephantech Has Developed Copper Nano-Paste
SAphire™ G for Glass Vias in Advanced PackagingLow-Shrinkage and Robust Metallization for High-AR TGVs

Elephantech Inc. has developed "SAphire™ G," a copper nano-paste for Through-Glass Via (TGV) filling, utilizing its proprietary Self-Assembling Copper Nanoparticle (SA-CuNP) technology.

Elephantech Develops DeepVia™ Silicon: A High-Aspect-Ratio Seed Layer Solution for 3D Semiconductor IntegrationA Novel Approach for Silicon Via Seed Layer Formation Addressing Increasing Aspect Ratios

Elephantech has developed a novel approach for forming copper seed layers in high-aspect-ratio (AR) silicon vias, utilizing proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3 : 1 to Advance AI computing

Elephantech announced the successful development of DeepVia™ HDI, a high-aspect-ratio microvia metallization solution based on its proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech to Present at SusHi Tech Tokyo 2026

Elephantech will present at SusHi Tech Tokyo 2026 on Tuesday, April 28, 2026.

Elephantech is to Sponsor and Exhibit at ICEP 2026

Elephantech Inc. will join the International Conference on Electronics Packaging (ICEP) 2026, hosted by the Japan Institute of Electronics Packaging (JIEP), held in Hiroshima from April 14 to 18.

Elephantech Selected for NEDO’s “GX Startup-Large Enterprise Collaboration and Funding Acceleration Program”

Elephantech Inc. is pleased to announce its selection for the “GX Sector Startup-Large Enterprise Collaboration and Funding Acceleration Program, Proof of Product Phase under Co-Creation Themes (GX_PoP Phase)”, conducted by the New Energy and Industrial Technology Development Organization (NEDO).

Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die AttachLow-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Inc. today announced the successful development of SAphire™ D, a low-temperature sintering copper nanopaste, based on its proprietary Self-Assembling Copper Nanoparticles (SA-CuNP) technology. The new paste is designed for next-generation power semiconductor die attach process.

Elephantech Announces Investment from Mitsubishi Electric and Strategic Partnership to Accelerate Global Deployment of SustainaCircuits

Elephantech has secured a JPY 4 billion investment from Mitsubishi Electric and entered into a strategic partnership.

We Are to Exhibit at Global Industrie Paris 2026

Elephantech will join Global Industrie Paris 2026, one of Europe’s leading manufacturing exhibitions, held in Paris, France, from March 30 to April 2, 2026.

Visit us at IPC APEX Expo 2026!

Elephantech will be exhibiting at IPC APEX EXPO 2026, to be held at the Anaheim Convention Center in California, USA, from March 17 (Tue) through March 19 (Thu) 2026.

Sumitronics Corporation Announces Implementation of Elephantech’s Inkjet Printing System

Sumitronics Corporation has issued a press release regarding the introduction of Elephantech’s advanced inkjet printing equipment, ELP04 PILOT 600R.

Visit Us at the 40th NEPCON Japan!

Elephantech will be exhibiting at NEPCON Japan 2026, held January 21–23 at Tokyo Big Sight, at the Sumitronics booth.

Elephantech Opens New R&D Site

Elephantech Inc. has commenced operations of a new R&D site in Mitsui Link Lab Shinkiba 3 (Link Lab), a large-scale laboratory facility in Tokyo.

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle InkA Novel Solution for High-Density Board Manufacturing

Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”