News

Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production
Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.

[Media Coverage] Latest Press Release Articles
The press release entitled “Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology“, which was distributed on December 17, 2024, was featured as an article in the following media outlets. ▶ SustainaCircuits: Japan’s Elephantech unveils general-purpose multilayer PCBs(DIGITIMES Asia) ▶ 日本Elephantech將噴墨印刷技術SustainaCircuits擴展至硬質多層電路板,能降低70%銅用量(cool3) ▶ 一PCB企业推出新产品, 可降低成本474亿, 覆盖78%市场(HNPCA) Media Coverage List of Media Articles

Exhibition at SEMICON Japan 2024
Elephantech will be exhibiting at SEMICON Japan 2024, which will be held at the Tokyo Big Sight from Wednesday, December 11 to Friday, December 13, 2024. SEMICON Japan 2024 Exhibition Information Exhibition SEMICON Japan 2024 Dates Wednesday, December 11 to Friday, December 13, 2024. Venue Tokyo Big Sight ( Access ) Booth Booth: 2028 Exhibitor Page EXHIBITOR DETAILS Elephantech’s inkjet technology Elephantech provides high-precision, high-productivity inkjet solutions through its 4th gener […]

Elephantech will exhibit at CEATEC 2024.
Elephantech will be exhibiting at CEATEC 2024, which will be held at the Makuhari Messe from Tuesday, October 15 to Friday, October 18, 2024. We provide the world’s highest level of high-precision, high-productivity inkjet solutions using our unique NeuralJet™ AI technology. At our booth, we will also provide information on the ELP04, a fourth-generation printer that enables process evolution in semiconductor packaging and FPD manufacturing through high-precision, uniform thin-film c […]