News

Elephantech selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field

Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.

Elephantech Launches World’s Smallest-Class Copper Nanofiller

Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller—the smallest class available globally.

[Media Coverage] Press Release : Elephantech Launches World’s Smallest-Class Copper Nanofiller

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches World’s Smallest-Class Copper Nanofiller.

Summer Break Announcement

We would like to inform you of Elephantech’s Summer Break Schedule: Dates: Saturday, August 9, 2025 – Sunday, August 17, 2025 Any inquiries received during the holiday period will be addressed in order starting on August 18 (Mon). We apologize for any inconvenience and appreciate your understanding. ▶ Download the Elephantech 2025 Business Calendar

Media Coverage: Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON.

[Media Coverage]Elephantech and Logitech Together Drive Disruptive Electronics Innovation

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech and Logitech Together Drive Disruptive Electronics Innovation.

Elephantech will be exhibiting at Automotive Engineering Exposition 2025 YOKOHAMA

Elephantech will be exhibiting at the Automotive Engineering Exposition 2025 YOKOHAMA from May 21 to May 23, 2025.

Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

Download April 22, 2025, Tokyo, Japan – Japanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing. As the first milestone of the new direction, Elephantech has signed its second Memorandum of Understanding (MoU) with Taiwan-based LITE-ON Technology Corporation (LITEON), deepening their strategic partnership in advancing environmentally responsibl […]

Elephantech and Logitech Together Drive Disruptive Electronics Innovation

Elephantech announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the PCB industry.

Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production

Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.

Golden Week Holiday Announcement

We would like to inform you of Elephantech’s Golden Week holiday schedule.

Elephantech to Sponsor and Exhibit at ICEP 2025

Through our sponsorship, we aim to actively support academic and technical discussions in electronics packaging and contribute to the advancement of sustainable electronic device manufacturing.

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025 from March 24 to 26, 2025.

Elephantech will exhibit at IPC APEX EXPO 2025

Elephantech will be exhibiting at IPC APEX EXPO 2025 in Anaheim, USA, March 18-20, 2025.

Elephantech will exhibit at MWC 2025

Elephantech will participate in MWC 2025, which will be held in Barcelona, Spain, from Monday, March 3 to Thursday, March 6, 2025, for four days.

[Media Coverage]DIGITIMES asia：AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors

Elephantech was featured in DIGITIMES Asia with an article titled “AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors.”

[Media Coverage] Press Release : Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology.

Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

We are pleased to announce that, due to several technological innovations, we have successfully developed general-purpose multilayer PCBs earlier than expected.

Developed adhesive coating technology for advanced packaging using high-precision inkjet technology

Elephantech has introduced an inkjet-based method for applying bonding materials essential for advanced packaging, such as those used in AI semiconductors.

FLEX Japan 2024 : Announcement of presentation

Our company’s co-founder, Masaaki Sugimoto, will be speaking at FLEX Japan 2024, held alongside SEMICON Japan 2024. We hope to see you there.