News
Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –
Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
Elephantech Launches Copper-on-Copper Self-Assembled Nanoparticles
– Unlocking New Possibilities in Semiconductor Packaging Materials –
Elephantech announced the successful development of Self-Assembled Copper Nanoparticles, a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.
We Look Forward to Seeing you at the Advanced Automotive Battery Conference 2025!
Elephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA. At this leading international platform, we are set to meet innovators and manufacturers from around the world to discuss the latest technological developments and market needs in the automotive battery field.
【Exhibition】Announcement: Exhibiting at the 4th NEPCON JAPAN [September]
Elephantech will be exhibiting at the 4th NEPCON JAPAN [Autumn], taking place September 17–19, 2025. At the event, we will showcase the capabilities of our world-class copper nanofiller to global electronics, semiconductor and automotive manufacturers.
Elephantech selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Media Coverage: Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON.