News
Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die Attach
Low-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles
Elephantech Inc. today announced the successful development of SAphire™ D, a low-temperature sintering copper nanopaste, based on its proprietary Self-Assembling Copper Nanoparticles (SA-CuNP) technology. The new paste is designed for next-generation power semiconductor die attach process.
Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –
Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
Elephantech Selected for NEDO’s “GX Startup-Large Enterprise Collaboration and Funding Acceleration Program”
Elephantech Inc. is pleased to announce its selection for the “GX Sector Startup-Large Enterprise Collaboration and Funding Acceleration Program, Proof of Product Phase under Co-Creation Themes (GX_PoP Phase)”, conducted by the New Energy and Industrial Technology Development Organization (NEDO).
Elephantech Launches Copper-on-Copper Self-Assembling Nanoparticles
– Unlocking New Possibilities in Semiconductor Packaging Materials –
Elephantech announced the successful development of Self-Assembling Copper Nanoparticles, a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.
We Look Forward to Seeing you at the Advanced Automotive Battery Conference 2025!
Elephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA. At this leading international platform, we are set to meet innovators and manufacturers from around the world to discuss the latest technological developments and market needs in the automotive battery field.
【Exhibition】Announcement: Exhibiting at the 4th NEPCON JAPAN [September]
Elephantech will be exhibiting at the 4th NEPCON JAPAN [Autumn], taking place September 17–19, 2025. At the event, we will showcase the capabilities of our world-class copper nanofiller to global electronics, semiconductor and automotive manufacturers.