News

【Exhibition】Announcement: Exhibiting at the 4th NEPCON JAPAN [September]
Elephantech will be exhibiting at the 4th NEPCON JAPAN [Autumn], taking place September 17–19, 2025. At the event, we will showcase the capabilities of our world-class copper nanofiller to global electronics, semiconductor and automotive manufacturers.

Elephantech selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.

[Video Release Announcement] Elephantech Flexible PCBs: AI-controlled copper inkjet printing for sustainable electronics future
An interview with Elephantech, recorded at Display Week 2025, is now available on YouTube. This video, titled “Elephantech flexible PCBs & AI-controlled copper inkjet printing for sustainable electronics future,” features Nobuhiko Okamoto, our Global Sales and Marketing Manager. He discusses our proprietary PCB manufacturing technology, “SustainaCircuits,” which significantly reduces environmental impact. In the interview, Mr. Okamoto details the technological advantages over co […]

Media Coverage: Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON.

Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
Download April 22, 2025, Tokyo, Japan – Japanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing. As the first milestone of the new direction, Elephantech has signed its second Memorandum of Understanding (MoU) with Taiwan-based LITE-ON Technology Corporation (LITEON), deepening their strategic partnership in advancing environmentally responsibl […]

Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production
Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.