News

Elephantech Develops DeepVia™ Silicon: A High-Aspect-Ratio Seed Layer Solution for 3D Semiconductor IntegrationA Novel Approach for Silicon Via Seed Layer Formation Addressing Increasing Aspect Ratios

Elephantech has developed a novel approach for forming copper seed layers in high-aspect-ratio (AR) silicon vias, utilizing proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3:1 to Advance AI computing

Elephantech announced the successful development of DeepVia™ HDI, a high-aspect-ratio microvia metallization solution based on its proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die AttachLow-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Inc. today announced the successful development of SAphire™ D, a low-temperature sintering copper nanopaste, based on its proprietary Self-Assembling Copper Nanoparticles (SA-CuNP) technology. The new paste is designed for next-generation power semiconductor die attach process.

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle InkA Novel Solution for High-Density Board Manufacturing

Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”

Elephantech Announces First Sale of ELP04 PILOT 600R, Accelerating Transformation of PCB Manufacturing

Elephantech announced the sale of the first unit of ELP04 PILOT 600R, the latest model in its ELP04 advanced inkjet equipment series.

Elephantech Launches Copper-on-Copper Self-Assembling NanoparticlesUnlocking New Possibilities in Semiconductor Packaging Materials

Elephantech announced the successful development of Self-Assembling Copper Nanoparticles, a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.

Elephantech Launches World’s Smallest-Class Copper Nanofiller

Japanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller—the smallest class available globally.

Developed adhesive coating technology for advanced packaging using high-precision inkjet technology

Elephantech has introduced an inkjet-based method for applying bonding materials essential for advanced packaging, such as those used in AI semiconductors.

Notice of Product Name Change – From P-Flex to SustainaCircuits™

SustainaCircuits™ better reflects our commitment to providing the most environmentally friendly and sustainable flexible circuit boards available, significantly outperforming conventional alternatives.

Elephantech announces new sustainable industrial printer

Japanese green tech innovator Elephantech today announced the release of their new industrial inkjet printing platform, the ELP04.

We have added Xacti Corporation to our mass production case studies.

P-Flex has been adopted in the camera unit for the following safety camera systems: Safety camera system for heavy machinery / Safety camera system for forklift

【Advantages of Using P-Flex®】Increase the frequency response of MEMS microphones with flexible substrates

MEMS microphones are used in various electronic devices including smartphones because of their small size and suitability for mass production. Most of them are surface-mount type and are mounted on PCBs.

[Interview] What is a new sample?

This Interview is with Mr. Ueno of our P-Flex® Sales Department about Elephantech’s new FPC P-Flex® sample boards.

P-Flex® Flexible Circuits mounted with a QFP

Held in Shinya Shimizu’s hand is a sample of a P-Flex® Flexible Circuits mounted with a QFP.

[Inkjet Lab Vol.1] Let’s Make an Origami Crane Fly by Itself!

Belonging to the Crafts Department of Tokyo University of the Arts, metal is usually at the core of what I make, be it banging out copper plates or mixing alloys for jewelry.

Launch of the Additive Manufacturing Center (2)

Learn how Elephantech advances additive manufacturing with inkjet-printed electrochemical sensors and paves the way toward broader applications beyond circuit printing.

【Ink Discharge Evaluation Service blog : 3】Introducing the Personnel Behind Elephantech’s Inkjet Technology

Introducing the Personnel Behind Elephantech’s Inkjet Technology

Launch of the Additive Manufacturing Center (1)

Among our existing services is the Ink Discharge Evaluation Service. Mr Saito, who is in charge of this particular service, joined us following a visit to our company on a tour organized by the Imaging Society of Japan.

【Ink Discharge Evaluation Service blog : 2】Video presentation of Epson’s inkjet machine for R&D purposes.

Here is an overview of Epson’s inkjet machine for R&D purposes used for our Ink Discharge Evaluation Service.

【Ink Discharge Evaluation Service blog : 1】Inkjet characteristics and evaluation

Elephantech is advancing the mass-production of P-Flex®, the company's Flexible Circuits, by using inkjet printing in its manufacturing process.