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Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech Has Developed Copper Nano-Paste
SAphire™ G for Glass Vias in Advanced PackagingLow-Shrinkage and Robust Metallization for High-AR TGVs

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3 : 1 to Advance AI computing

"Technical articles"

We will provide information from various angles, focusing on Elephantech’s manufacturing, development, and other technical information.

R&D用インクジェット装置の概要

【Ink Discharge Evaluation Service blog : 2】Video presentation of Epson’s inkjet machine for R&D purposes.

Here is an overview of Epson’s inkjet machine for R&D purposes used for our Ink Discharge Evaluation Service.

Announcing Launch of Ink Discharge Evaluation Service

【Ink Discharge Evaluation Service blog : 1】Inkjet characteristics and evaluation

Elephantech is advancing the mass-production of P-Flex®, the company's Flexible Circuits, by using inkjet printing in its manufacturing process.

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