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Elephantech Introduces DS-SAP™ for Fine Patterning on Semiconductor Package SubstratesDual-Seed Technology Enables Higher Density for Advanced AI Packaging

Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3 : 1 to Advance AI computing

"Technical articles"

We will provide information from various angles, focusing on Elephantech’s manufacturing, development, and other technical information.

最初のキックスターターの時の様子

Launch of the Additive Manufacturing Center (1)

Among our existing services is the Ink Discharge Evaluation Service. Mr Saito, who is in charge of this particular service, joined us following a visit to our company on a tour organized by the Imaging Society of Japan.

R&D用インクジェット装置の概要

【Ink Discharge Evaluation Service blog : 2】Video presentation of Epson’s inkjet machine for R&D purposes.

Here is an overview of Epson’s inkjet machine for R&D purposes used for our Ink Discharge Evaluation Service.

Announcing Launch of Ink Discharge Evaluation Service

【Ink Discharge Evaluation Service blog : 1】Inkjet characteristics and evaluation

Elephantech is advancing the mass-production of P-Flex®, the company's Flexible Circuits, by using inkjet printing in its manufacturing process.

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