Solutions
The rapid growth of AI computing is driving demand for advanced hardware with unprecedented electrical, architectural, and thermal performance.
Elephantech addresses these challenges by combining precision inkjet printing with nanomaterial expertise. Building on these unique strengths, we deliver two versatile platforms: Nano Copper Deposition and the SAphire™ copper nanopaste family.
By expanding the ways copper is formed and connected, we empower performance and process innovations in semiconductor packaging, electronics manufacturing, and advanced interconnects.
High-AR Microvia Metallization
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A proprietary technology platform for continuous seed-layer formation in high-aspect-ratio vias. Designed for advanced packaging applications including HDI, package substrates and silicon interposers.
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Sintering Copper Nanopaste
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A family of copper nanopastes engineered for low-temperature and pressureless sintering, enabling robust bonding and efficient heat dissipation. Designed for advanced electronics applications including die attach, TIM, TGV filling and inter-board connections.
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Sustainable PCB Manufacturing
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An inkjet-based PCB manufacturing platform that forms seed layers through a DES-free process. Applicable to both rigid and flexible PCBs.
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