DK100
DK100 pairs with Elephantech’s proprietary copper nanoink to enable DeepVia™ HDI, an integrated printing solution that precisely deposits ink to form a continuous seed layer in high-aspect-ratio microvias.
The systems achieves reliable via metallization in structures that are difficult to address with conventional processes, supporting higher-performance AI substrates.
Features
- High-precision inkjet controllability for accurate droplet placement in high-aspect-ratio microvias.
- Optimized compatibility with Elephantech's self-spreading copper nanoink to ensure uniform seed layer formation across the via surface.
- Direct ink delivery into deeper regions of the via, overcoming transport limitations of conventional solution-based processes.
Specifications
| Model | DK100 |
|---|---|
| Max. Panel Size | 550 x 622 mm |
| Stage Speed | 267 mm/sec |
| Stage Accuracy | Accuracy ±20 μm, Precision ±5 μm |
| Printhead | EPSON PrecisionCore D3000-U1R |
| Dedicated consumable | Elephantech proprietary copper nanoink NCT-05 |
Applications
-
High-aspect-ratio microvia metallization
Dedicated Ink
Built on a unique 15-nm nanoparticle design, the ink offers excellent dispersion stability for up to six months and process flexibility, with no on-site dilution required.