SAphire™
Copper is emerging as a promising material for next-generation electronic joining, offering strong electrical and thermal performance, high-temperature reliability, and cost advantages. However, conventional copper sintering still faces challenges in manufacturing maturity, limiting its broader adoption.
Built on Elephantech’s proprietary Self-Assembling Copper Nanoparticle technology, SAphire™ is engineered to overcome these conventional limitations of copper. By combining the inherent advantages of copper with enhanced processability and application-specific performance, the SAphire™ family of sintering copper nanopastes enables bonding, filling, and interconnection for increasingly powerful and complex electronic systems.
Qualitative comparison of typical material characteristics
Our Solutions:
SAphire™ D
SAphire™ D achieves excellent bonding strength through low-temperature, pressureless sintering.
It enables reliable, thermally stable die attach and thermal interface applications for advanced power devices.
Die-attach sample using SAphireTM D
SAphire™ G
SAphire™ G suppresses sintering-induced shrinkage and stress on glass, minimizing the risk of voids and cracks.
This makes it ideal for high-aspect-ratio TGV filling, improving long-term reliability and manufacturing yield.
TGV filling using SAphireTM G
SAphire™ B
SAphire™ B forms robust copper interconnects with low, consistent electrical resistance and high thermal stability.
It enables modular manufacturing of ultra-high-layer-count PCBs with greater design freedom and scalability.
Reliability results of inter-board connections using SAphireTM B