Milestones

Founded as AgIC Inc. in Bunkyo-ku, Tokyo.

Initiated technical validation of flexible printed circuits (FPCs) using inkjet printing technology.

Launched sales of FPC product, P-Flex™ made using proprietary Pure Additive™ process.

Renamed the company to Elephantech Inc.

Relocated Headquarters to Chuo-ku, Tokyo and established a small-scale demonstration line.

Launched sales of polyimide-based FPC.

Entered into collaborations with Seiko Epson Corporation, Mitsui Chemicals, Inc. and Sumitomo Corporation.

Raised JPY 1.8 billion in funding.

Established AMC Nagoya, the Pure Additive™ FPC mass production site.

P-Flex™ PI obtained U.S. UL certification, safety standards established by Underwriters Laboratories Inc. (UL).

AMC Nagoya obtained ISO 9001 and ISO 14001 certifications.

Established Shinkiba R&D Center.

Raised JPY 3.9 billion in funding.

Signed a Memorandum of Understanding (MoU) with LITEON Technology Corporation to advance the mass production of low-carbon printed circuit boards (PCBs).

Raised JPY 3 billion in funding.

Initiated the rollout of SustainaCircuits™, a new brand evolved from P-Flex™.

Launched the 4th-generation inkjet printing platform and the ELP04 PCB manufacturing system based on it.

Developed general-purpose multilayer PCBs powered by SustainaCircuits™.

SustainaCircuits™ adopted in mass production for Logitech International’s mouse products.

Signed a second MoU with LITEON to advance the adoption of SustainaCircuits™ in its supply chain.

Launched sales of the proprietary inkjet equipment series and achieved the first commercial sale of the initial model.

Developed a novel HDI microvia formation process using copper nanoparticle ink.

Entered into strategic collaboration with Mitsubishi Electric Corporation.

Raised JPY 4.2 billion in funding.