Power semiconductor packaging SAphire™ D
The SAphire™ D series is a sintering copper nanopaste that combines pressureless, low-temperature sintering with cost effienciency.
Based on Elephantech's proprietary Self-Assembling Copper Nanoparticle technology, it delivers high bonding strength and bonding reliability, making it ideal for die attach and power semiconductor TIM applications.
Features
- Resolves the tradeoff between nanoparticle loading and stability, achieving excellent sinterability with only ~10 wt% copper nanoparticles.
- Enhances process flexibility under low-temperature, pressureless conditions while maintaining high bonding strengh.
- Provides high thermal conductivity and thermally robust interconnects for next-generation high-power-density devices.
Specifications
Applications
-
Die Attach
-
Thermal Interface Material (TIM)