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Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die Attach
Low-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Announces Investment from Mitsubishi Electric and Strategic Partnership to Accelerate Global Deployment of SustainaCircuits

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –

[Media Coverage]imagemagazine.com:Epson partners with new startup Elephantech to supply printheads

Imagemagazine.com published an article about Epson partners with new startup Elephantech to supply printheads. Media Coverage List of Media Articles

Elephantech

[Media Coverage]Sprinter:Epson partners with new startup Elephantech to supply printheads

Sprinter published an article about Epson invests in printed electronics startup Elephantech. Media Coverage List of Media Articles

Focus NEDO No.73 Special Edition NEDO Startup Future

On “Focus NEDO No.73 Special Edition NEDO Startup Future” published by NEDO*, our company was featured as a startup company that manufatures and sells P-Flex🄬, a single sided flexible PCB manufactured with the use of inkjet printing and copper plating.

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