News
【Exhibition】Announcement: Exhibiting at the 4th NEPCON JAPAN [September]
Elephantech will be exhibiting at the 4th NEPCON JAPAN [Autumn], taking place September 17–19, 2025. At the event, we will showcase the capabilities of our world-class copper nanofiller to global electronics, semiconductor and automotive manufacturers.
Elephantech selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
Elephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Media Coverage: Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON.
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon printed circuit board manufacturing.
Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production
Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.