Milestones
2014
Founded as AgIC Inc. in Bunkyo-ku, Tokyo.
2016
Initiated technical validation of flexible printed circuits (FPCs) using inkjet printing technology.
2017
Launched sales of FPC, P-Flex™, made using proprietary Pure Additive™ processing.
Renamed the company to Elephantech Inc.
2018
Relocated headquarter to Chuo-ku, Tokyo and established a small-scale demonstration line.
Launched sales of polyimide-based FPC P-Flex™ PI.1
2019
Formed alliances with Seiko Epson Corporation and Mitsui Chemicals, Inc.
Raised a total of 1.8 billion yen in funding.
2020
Established AMC Nagoya as Pure Additive™ PCB mass production site.
2022
AMC Nagoya obtained ISO 9001 and ISO 14001 certifications.
Established Shinkiba R&D Center.
2023
Achieved 3.9 billion yen fund-raising.
2024
Achieved 3 billion yen in total funding.
Unified P-Flex™ products and Pure Additive™ technology branding under the proprietary SustainaCircuits™ brand.
Launched ELP-04: a cutting-edge inkjet printing platform for industrial PCB manufacturing.
Successfully developed general-purpose multilayer PCBs powered by SustainaCircuits™.
2025
Established new business by launching SustainaCircuits™ multilayer PCB production solutions.
Introduced world-class innovations including expanding FPC specifications to support thin- and thick-copper designs and launching 15nm copper nano filler.
1: PI stands for Polyimide, which is the base material for flexible substrates.