Milestones

2014

Founded as AgIC Inc. in Bunkyo-ku, Tokyo.

2016

Initiated technical validation of flexible printed circuits (FPCs) using inkjet printing technology.

2017

Launched sales of FPC, P-Flex™, made using proprietary Pure Additive™ processing.

Renamed the company to Elephantech Inc.

2018

Relocated headquarter to Chuo-ku, Tokyo and established a small-scale demonstration line.

Launched sales of polyimide-based FPC P-Flex™ PI.1

2019

Formed alliances with Seiko Epson Corporation and Mitsui Chemicals, Inc.

Raised a total of 1.8 billion yen in funding.

2020

Established AMC Nagoya as Pure Additive™ PCB mass production site.

2022

AMC Nagoya obtained ISO 9001 and ISO 14001 certifications.

Established Shinkiba R&D Center.

2023

Achieved 3.9 billion yen fund-raising.

2024

Achieved 3 billion yen in total funding.

Unified P-Flex™ products and Pure Additive™ technology branding under the proprietary SustainaCircuits™ brand.

Launched ELP-04: a cutting-edge inkjet printing platform for industrial PCB manufacturing.

Successfully developed general-purpose multilayer PCBs powered by SustainaCircuits™.

2025

Established new business by launching SustainaCircuits™ multilayer PCB production solutions.

Introduced world-class innovations including expanding FPC specifications to support thin- and thick-copper designs and launching 15nm copper nano filler.

1: PI stands for Polyimide, which is the base material for flexible substrates.