Elephantech to Sponsor and Exhibit at ICEP 2025

Elephantech is pleased to announce our sponsorship and participation in ICEP 2025, taking place in Nagano from April 15 to 19.

As one of the world’s leading international conferences in the field of electronics packaging technology, ICEP brings together top researchers and engineers from industry, academia, and government. The conference covers a wide range of topics, including advanced packaging, power electronics, materials, and process technologies, providing a platform for presenting cutting-edge research and fostering in-depth discussions.

Through our sponsorship of this conference, we aim to support and promote academic and technical discussions on electronics packaging technology while contributing to the advancement of sustainable electronic device manufacturing.
Our company is committed to transforming semiconductor manufacturing processes by leveraging innovative printing technologies and materials, with the goal of accelerating technological innovation in this field.

At this conference, we look forward to engaging in active discussions with participants, gaining new insights, and exploring opportunities for collaboration.Through these efforts, we strive to contribute to the overall progress of the industry by advancing more efficient and environmentally conscious semiconductor manufacturing technologies.

ICEP 2025

We will showcase samples demonstrating the capabilities of our Copper Nanoparticle Ink and Elephantech’s Gen 4 inkjet printing platform ELP04 printing platform. We warmly invite you to stop by and explore our latest innovations.