Elephantech Inc. will join the International Conference on Electronics Packaging (ICEP) 2026, hosted by the Japan Institute of Electronics Packaging (JIEP), held in Hiroshima from April 14 to 18.
As one of the world’s premier international conferences on electronics packaging, ICEP serves as a vital platform for leading researchers and engineers from academia, industry, and government. It is a hub for presenting and discussing the latest breakthroughs in advanced packaging, power electronics, materials, and process technologies.
About ICEP 2026
| Conference | ICEP 2026 |
| Date | April 14-18, 2026 | Venue | International Conference Center Hiroshima 1-5 Nakajima-cho, Naka-ku, Hiroshima, Japan |
Exhibition Highlights
- SAphire™ D: Copper Sintering Paste for Next-Generation Power Semiconductors
SAphire™ D, our newly announced low-temperature sintering copper nanopaste based on a novel Self-Assembling Copper Nanoparticles mechanism, will be showcased. Its strong bonding performance (> 40 MPa) and high thermal conductivity at low-temperature sintering, combined with superior cost competitiveness compared to silver-based materials, make it a promising solution for die attach applications.
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High-Precision Inkjet Platform ELP04 Series for Advanced Packaging
Assisted by our proprietary AI model “NeuralJet®”, the inkjet equipment features selective, precise droplet deposition for high-aspect-ratio blind via and TGV metallization, which have been challenging for conventional approaches. Various samples produced using the equipment will be on display.
Through the exhibition, Elephantech aims to deepen exchange with technical experts, manufacturers and solution providers to together advance innovative electronics manufacturing.