Elephantech will be exhibiting at IPC APEX EXPO 2025 in Anaheim, USA, March 18-20, 2025.
SustainaCircuits™ Rigid PCB and FPC utilize newly developed copper nanoparticle ink and primer technology, offering enhanced adhesion on various substrates and potential applications in Advanced PCB and Printed Electronics.
This innovative approach addresses key challenges in the industry, such as environmental concerns and the need for more efficient manufacturing processes.
Exhibition details
・New material （Cu nanoparticle Ink、Primer）
・SustainaCircuits™ Rigid PCB、FPC
・Printed wiring formed on various substrates.
| Conference | IPC APEX EXPO 2025 |
| Date | 18 – 20 March 2025 |
| Venue | Anaheim Convention Center 800 W Katella Ave Anaheim, CA 92802 United States |
| Booths We are participating in | 3725 |
| Elephantech page | Elephantech |
【IPC APEX EXPO 2025】report
🚀We had a great time exhibiting at #IPCAPEXEXPO!
We showcased rigid PCB and FPC samples using Elephantech's technology, along with application samples demonstrating strong adhesion to various substrates.
Thank you to everyone who visited our booth!#Innovation #Sustainability pic.twitter.com/4kHWXouYzc— Elephantech_Inc (@elephantech_Inc) March 20, 2025