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Top> News> [Media Coverage] Press Release : Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

[Media Coverage] Press Release : Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

12.20.2024
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The press release entitled “Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology“, which was distributed on December 17, 2024, was featured as an article in the following media outlets.

▶ SustainaCircuits: Japan’s Elephantech unveils general-purpose multilayer PCBs(DIGITIMES Asia)

www.digitimes.com

SustainaCircuits: Japan's Elephantech unveils general-purpose multilayer PCBs



▶ 日本Elephantech將噴墨印刷技術SustainaCircuits擴展至硬質多層電路板,能降低70%銅用量(cool3)

www.cool3c.com

日本Elephantech將噴墨印刷技術SustainaCircuits擴展至硬質多層電路板,能降低70%銅用量 #印刷電路板 (231047) - Cool3c

Chevelle.fu發佈日本Elephantech將噴墨印刷技術SustainaCircuits擴展至硬質多層電路板,能降低70%銅用量,最新資訊於2025-11-26 21:02:技術活用於印刷電路板的日本新創公司Elephantech宣布其SustainaCircuits技術從現階段僅能在單面...#(231047)



▶ 一PCB企业推出新产品, 可降低成本474亿, 覆盖78%市场(HNPCA)

mp.weixin.qq.com



Media Coverage

List of Media Articles

Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology
[Media Coverage]DIGITIMES asia:AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors
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