【Exhibition】Announcement: Exhibiting at the 4^th NEPCON JAPAN [September]

Elephantech will be exhibiting at the 4^th NEPCON JAPAN [September], taking place September 17–19, 2025. At the event, we will showcase the capabilities of our world-class copper nanofiller to global electronics, semiconductor and automotive manufacturers. Visitors will have the opportunity to experience samples of our 15nm fine particle material first-hand.

We will also be delivering a presentation on “The Potential of New Copper Nanofiller and Primer Materials”, at the Advanced Material Forum on September 18th, 2:00-2:30 PM,.

About Copper Nanofiller

Our exhibition will be centered around Elephantech’s proprietary 15nm-class fine particle copper nanofiller, developed using our advanced synthesis technology.
Known as a “high-conductivity filler”, the material offers outstanding electrical conductivity, low resistance, and excellent thermal conductivity. It is expected to be applied across the electronics industry, spanning conductive inks, pastes, and bonding and heat dissipation materials.

About NEPCON JAPAN [September]

NEPCON JAPAN is a leading trade show that brings together cutting-edge electronic components, materials, and state-of-the-art manufacturing, mounting, and inspection equipment that support the evolution of electronics.