SEMICON Japan 2024 Exhibition Information
| Exhibition | SEMICON Japan 2024 |
| Dates | Wednesday, December 11 to Friday, December 13, 2024. |
| Venue | Tokyo Big Sight ( Access ) |
| Booth | Booth: 2028 |
| Exhibitor Page | EXHIBITOR DETAILS |
Elephantech’s inkjet technology
Elephantech provides high-precision, high-productivity inkjet solutions through its 4th generation ELP04 printer, equipped with the company’s AI-assisted technology, NeuralJet™.
This technology is capable of discharging several picoliter droplets with extremely high positional accuracy of less than 1 μm. This makes it possible to form various materials, such as dielectric material and adhesive, with high flatness in a wide range of film thicknesses, from submicrons to tens of micrometers.
We provide comprehensive solutions, offering consistent support from material ink formulation to the practical implementation of inkjet processes, offering a complete solution. Elephantech’s inkjet technology provides customers with innovative options.
SEMICON 2024 Exhibition Details
For semiconductor manufacturers, including end-users, and package substrate manufacturers, we will showcase various demonstrations using inkjet technology as a new option in the semiconductor manufacturing coating process.
We invite you to visit our booth during the exhibition. Our team will be pleased to offer detailed technical explanations and guide you through solutions tailored to your specific needs.
High-temperature adhesive coating on wafers using inkjet (Material provided by Mitsui Chemicals, Inc.)
The feature of this technology is that it can freely control the application of materials and film formation on semiconductors, which was previously difficult, such as changing the film thickness in each area and patterning, using inkjet technology. It is also expected to help reduce environmental impact.
- Controlled film thickness by area
- Selective material discharging through patterning
- High Ra
The Application of Heterogeneous Bonding Materials for Advanced packaging and silicon photonics (Materials provided by Mitsui Chemicals, Inc.)
In addition, we will be exhibiting various proposals that utilize inkjet technology for next-generation advanced packaging technology and device manufacturing in the field of silicon photonics, including uniform coating and more.