Advanced copper nanomaterials Copper Nanofiller
15 nm-class copper nanofillers deliver excellent electrical conductivity, low volume resistance and long-term dispersion stability.
It can be formulated into into inks, pastes and so on, with the ink application playing a key role in Elephantech’s SustainaCircuits solution.
Key Features
- 15 nm-class copper nano-particles achieved by advanced synthesis technology
- Advanced formulation enabled outstanding dispersion stability for up to 6 months
- Low-temperature wet reduction below 60 °C allows compatibility with heat-sensitive substrates
Specifications
| Average particle size | 15 nm |
|---|---|
| Viscosity | 100~1,000 mPa・s （25 ℃） |
| Specific gravity | 3.2～3.5 g/cm³ |
| Solid content | 55-85 wt% |
Applications
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PCB wiring
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Solar cell collecting electrodes
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Bondin material for power semiconductors
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MLCC electrodes
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Sensors /Antennas / EMI shielding