Copper Nanofiller Self-Assembled Copper Nanoparticles (SA-CuNP)
An innovative technology that imparts dispersibility to paste materials through a novel self-assembly mechanism.
By forming a nanoparticle layer on microparticle surfaces, it enables paste formulations with significantly reduced dispersant molecular weight and loading, greatly expanding material design flexibility.
Key Features
- 15 nm-class self-assembled copper nanoparticles achieved by advanced synthesis technology
- Surface-coating dispersion model enables effective dispersion with a minimal amount of organic components
- Achieves significant enhancement in bonding strength with only a small additive amount
Commercial Model
| Product supply | Provision of SA-CuNP (on a paid basis) |
|---|---|
| Licensing | Licensing of dispersion design technology utilizing SA-CuNP |
| Co-development | Paste optimization through collaborative development projects |
Applications
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Bonding/Thermal Management (for power semiconductor, chip packaging, and thermal substrate assembly)
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Electrodes (passive components including MLCC)
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Wiring (solar cells)