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Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die Attach
Low-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Announces Investment from Mitsubishi Electric and Strategic Partnership to Accelerate Global Deployment of SustainaCircuits

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –

July, 2023

【Joint Press Release】Inkjet 4D Print: Self-folding Tessellated Origami Objects by Inkjet UV Printing

Learn about the groundbreaking Inkjet 4D Print method for creating complex self-folding tessellated objects with precision and efficiency. Details inside.

Elephantech Inc. was selected as one of the winners of Logitech’s Future Positive Challenge

Elephantech Inc. (Head Office: Chuo-ku, Tokyo; CEO & CTO: Shinya Shimizu, hereinafter “Elephantech”) was selected as one of the winners of Logitech’s Future Positive Challenge, a technology challenge for sustainability-led disruptors poised to make a meaningful contribution to a positive future.

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