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Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die Attach
Low-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Announces Investment from Mitsubishi Electric and Strategic Partnership to Accelerate Global Deployment of SustainaCircuits

Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –

August, 2023

Elephantech wins the METI Award at the “Award for Academic Startups 2023”

Elephantech was awarded the “METI(Minister of Economy, Trade and Industry) Award” in the “Award for Academic Startups 2023” hosted by the Japan Science and Technology Agency (JST) and the New Energy and Industrial Technology Development Organization (NEDO).

Elephantech will be exhibiting at Digital Demo Day 2023 (Düsseldorf / Germany).

Elephantech will be at the August 17, 2023, Digital Demo Day 2023, a German’s in Düsseldorf, Germany.

Elephantech will be exhibiting at the Meet Greater South.

Elephantech will be exhibiting at Meet Greater South, at the Kaohsiung Exhibition Center in Kaohsiung, Taiwan, from August 25 (Friday) to August 26 (Saturday), 2023.

Announcement of Management Personnel Changes

Elephantech Inc. (Head Office: Chuo-ku, Tokyo; Shinya Shimizu, CEO) is pleased to announce the appointment of Keisuke Ito, Hiroaki Nasu, Keita Sakimura, and Naohiro Hirata as new Executive Officers, effective August 1, 2023, to strengthen its business execution structure.

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