News
Elephantech wins the METI Award at the “Award for Academic Startups 2023”
Elephantech was awarded the “METI(Minister of Economy, Trade and Industry) Award” in the “Award for Academic Startups 2023” hosted by the Japan Science and Technology Agency (JST) and the New Energy and Industrial Technology Development Organization (NEDO).
Elephantech will be exhibiting at Digital Demo Day 2023 (Düsseldorf / Germany).
Elephantech will be at the August 17, 2023, Digital Demo Day 2023, a German’s in Düsseldorf, Germany. Digital Demo Day 2023 is Germany’s largest B2B Startup Expo & Conference, featuring over 250 startups in the fields of VR, AR, IoT cybersecurity, smart devices, drones, robotics, and more. ▶ Digital Demo Day 2023 : https://www.digitaldemoday.com/ At the Elephantech booth, we will show samples of our flexible circuits using metal nanoparticles inkjet printing and electroless copper plating t […]
Elephantech will be exhibiting at the Meet Greater South.
Elephantech will be exhibiting at Meet Greater South, at the Kaohsiung Exhibition Center in Kaohsiung, Taiwan, from August 25 (Friday) to August 26 (Saturday), 2023. As one of the leading startup expos in Asia, Meet Greater South is the largest go-to platform for startups and all the key players in the local and global ecosystem, including venture capitalists, investors, corporates, incubators, accelerators, service-providers, media and government initiatives. 大象科技将参展于2023年8月25日（星期五）至8月26日（星期六）在 […]
Announcement of Management Personnel Changes
Elephantech Inc. (Head Office: Chuo-ku, Tokyo; Shinya Shimizu, CEO) is pleased to announce the appointment of Keisuke Ito, Hiroaki Nasu, Keita Sakimura, and Naohiro Hirata as new Executive Officers, effective August 1, 2023, to strengthen its business execution structure.
【Joint Press Release】Inkjet 4D Print: Self-folding Tessellated Origami Objects by Inkjet UV Printing
We would like to inform you that a Joint Press Release has been issued regarding the “Inkjet 4D Print: Self-folding Tessellated Origami Objects by Inkjet UV Printing” technology. Mr. Sugimoto, our company’s Senior Vice President, participated in this project. Citation: Inkjet 4D Print: Self-folding Tessellated Origami Objects by Inkjet UV Printing We propose Inkjet 4D Print, a self-folding fabrication method of 3D origami tessellations by printing 2D patterns on both sides of a […]
Elephantech Inc. was selected as one of the winners of Logitech’s Future Positive Challenge
Elephantech Inc. (Head Office: Chuo-ku, Tokyo; CEO & CTO: Shinya Shimizu, hereinafter “Elephantech”) was selected as one of the winners of Logitech’s Future Positive Challenge, a technology challenge for sustainability-led disruptors poised to make a meaningful contribution to a positive future.
[Media Coverage] 5thelement: Shinya’s story from childhood interest in science, to now reducing water, resources, & energy consumption of printed circuitboards
We are excited to inform you that an interview featuring Shinya Shimizu, the co-founder, CEO, and CTO of Elephantech, is now accessible on YouTube. It’s part of the “LeadersWhoCare®” series, and we are thrilled to share it with you! Unreasonable Commitment to Impact (Shimizu Shinya) #Elephantech achieved a milestone in #PCB mfg, 1st co to manufacture PCBs using metal inkjet printing successfully. Shinya’s story from childhood interest in #science, to now reducing #water, […]
Elephantech Chosen as “Innovation Showcase” at the “2023 Japan – U.S. Innovation Awards”
Elephantech has been chosen as one of the 5 Japanese startup companies to participate in the prestigious “Innovation Showcase” at the “2023 Japan-U.S. Innovation Awards.” This recognition highlights Elephantech’s new technologies and innovative business ideas that have the potential for a significant global impact. “The Japan-U.S. Innovation Awards” is an initiative co-organized by the Japan Society of Northern California and Stanford University US-Asia […]
[Media Coverage] TechBlick: Additive electronics: mass production of multi-layer FPCBs and RPCBs with inkjet printing
We are pleased to announce that information about our company has been published on TechBlick! Twitter Additive electronics is sustainable reducing copper and water consumption vs. the traditional PCB production processes by 70% and 95%, respectively whilst reducing the carbon footprint by 75%. Article by @TechBlickGlobal: https://t.co/we31wz9A7Q#3DElectronics #3DPrinting #AM pic.twitter.com/Wq6de0xBk7 — Wevolver (@WevolverApp) June 21, 2023
Google for Startups Hiroshima Startup Summit: Masaaki Sugimoto, cofounder and Senior Vice President of Elephantech, will participate in a panel discussion by startup companies.
On Tuesday, June 20, 2023, Masaaki Sugimoto, one of the co-founders and senior vice presidents of Elephantech, will participate in a panel discussion with startups at the Google for Startups Hiroshima Startup Summit in Hiroshima. Outline Title Google for Startups Hiroshima Startup Summit Date Tuesday, June 20, 2023 Venue HIROSHIMA ORIZURU TOWER（12F）
Elephantech’s co-founder, CEO, and CTO, Shinya Shimizu, will speak at the Innovation Showcase session at the 2023 Cleantech Forum Asia held in Singapore!
Elephantech’s co-founder, CEO, and CTO, Shinya Shimizu, will speak at the Innovation Showcase session (June 6, 4:10 PM -5:00 PM, SGT) at the 2023 Cleantech Forum Asia held in Singapore on June 6 and 7, 2023. Agenda: https://www.cleantech.com/event/cleantech-forum-asia/#agenda-1 Outline Join us at Cleantech Forum Asia on 6-7 June in Singapore for two days of insight, opportunity, and knowledge. Cleantech Forums offer participants easy access to start-ups, scale-ups, investors, and multinati […]
Elephantech will be exhibiting at NextRise 2023, Seoul, the largest startup conference in Korea.
Elephantech will be exhibiting at NextRise 2023, Seoul, Korea, from Thursday, June 1 to Friday, June 2, 2023. NextRise 2023, Seoul, is the largest startup conference in Korea, attended by about 200 of the world’s largest companies, mid-sized firms, and venture capitalists. [Report on NextRise 2023, Seoul(Korea)] [Report on NextRise 2023, Seoul(Korea)] The exhibition begins today!We look forward to seeing you at our booth. Booths We are participating in:participating in5×5-4 : Hall A (JETRO […]
Elephantech will be exhibiting at Dublin Tech Summit 2023.
Elephantech will be exhibiting at Dublin Tech Summit 2023, a startup event to be held in Dublin, Ireland, from Wednesday, May 31, to Thursday, June 1, 2023. Dublin Tech Summit is one of Europe’s fastest-growing B2B technology events. [Dublin Tech Summit 2023 Report] 【Dublin Tech Summit 2023 Report】 Our company's Saito has been selected as one of the five finalists out of 26 participating companies in the Pitch Competition at the Dublin Tech Summit 2023, a startup event hosted in Dublin […]
Elephantech will be exhibiting at InnoVEX2023, Asia’s largest Startup Event.
Elephantech will be exhibiting at InnoVEX 2023, Asia’s largest Startup Event, at the Taipei Nangang Exhibition Center in Taipei, Taiwan, from May 30 (Tuesday) to June 2 (Friday), 2023. In addition, on Wednesday, May 31, Masaaki Sugimoto, the co-founder and Senior Vice President of Elephantech, will be a speaker at the Japan Startups Demo Day. ▶ InnoVEX 2023 ▶ Japan Startups Demo Day [Report on InnoVEX2023 Taipei (Taiwan)] InnoVEX is a specialized startup exhibition within COMPUTEX, Asia […]
Elephantech raises 900 million yen through third-party allotment of new shares.
-Total amount raised reaches 9 billion yen-
Elephantech Inc. (Shinya Shimizu, CEO & CTO, Headquarters: Chuo-ku, Tokyo), a developer of innovative manufacturing technologies that significantly reduce water, resources, and energy consumption of printed circuit boards, has raised approximately 900 million yen through a third-party allocation of new shares.
Flexible Circuit Board P-Flex® improves the Thermal Response Time of Temperature Sensor ICs and Thermistors
P-Flex® flexible circuit boards can improve the thermal response time of temperature sensor ICs and thermistors, enabling quicker control in temperature-triggered equipment like air conditioners. Using flexible substrates reduces thermal mass and improves thermal response time, allowing for energy savings, lower electricity costs, improved comfort, and equipment malfunction detection. Separating the temperature sensor from the main board reduces heat influence, and flexible PCBs can extend measurement distance.
【Advantages of Using P-Flex®】Increase the frequency response of MEMS microphones with flexible substrates
Advantages of Using P-Flex® for MEMS Microphones MEMS microphones are used in various electronic devices including smartphones because of their small size and suitability for mass production. Most of them are surface-mount type and are mounted on PCBs. Types of MEMS Microphones: Top Port Type and Bottom Port Type MEMS microphones have a small hole in the case to capture sound. If the hole is on the top cover side, it is called a top-port type, and if it is on the PCB side, it is called a bottom- […]
Elephantech Joins Ministry of the Environment’s Carbon Neutral Technology Research and Development Program
Elephantech Inc. is pleased to announce that the company’s project to “develop large-scale mass production printing technologies to lower the environmental impact of circuit board manufacturing” was selected by the Ministry of the Environment for the Local Co-creation and Cross-Sectoral Category of its FY2023 Carbon Neutral Technology Research and Development Program.
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