On August 6, 2026(PT), Shinya Shimizu, Founder and CEO of Elephantech, will present at a webinar hosted by the IEEE Electronics Packaging Society (EPS) Santa Clara Valley Chapter, an IEEE chapter dedicated to electronics packaging and assembly technologies.
The session will explore one of the major challenges in AI-driven advanced packaging: enabling high-density interconnect architectures. Shimizu will introduce Elephantech’s proprietary Nano Copper Deposition platform and discuss how it achieves precise and reliable wiring across MSAP, SAP, and Damascene-based manufacturing processes.
Attendees will learn how Elephantech’s DeepVia™ HDI, DS-SAP™ and DeepVia™ Silicon solutions can help improve routing capability, design flexibility and production yield through ultra-fine-line wiring and reliable high-aspect-ratio via metallization for advanced PCB, package substrate and silicon applications.
We look forward to meeting you at the session!
Presentation Details
| Official Event Page | Dual Seed Semi-Additive and Damascene Processes: Enabling Fine-Pitch Interconnects for Advanced Packaging |
| Date & Time | August 6, 2026 (Thu) 4:00 PM PT / August 7, 2026 (Fri) 8:00 AM JST | Format | Online Webinar (45-minute presentation followed by a 15-minute Q&A session) |
| Organizer | IEEE Electronics Packaging Society (EPS) Santa Clara Valley Chapter |