Elephantech has joined the Center for Heterogeneous Integration and Performance Scaling (CHIPS), a university-industry consortium at the University of California, Los Angeles (UCLA).
UCLA CHIPS brings together industrial partners, academia, and government organizations to advance chip design, heterogeneous integration, and next-generation hardware systems. Its members collaborate on transforming cutting-edge technological breakthroughs into industrial solutions while shaping the roadmap for future computing platforms.
Through its participation in UCLA CHIPS, Elephantech will utilize its expertise in:
- Nano Copper Deposition: An inkjet-based copper seed-layer formation platform that dispenses copper nanoparticle ink onto targeted areas with precise spatial control. Compatible with mSAP, SAP, and Damascene processes, it enables continuous metallization inside high-aspect-ratio vias and other three-dimensional interconnect structures. Its compatibility with ultra-fine-line patterning contributes to high-density, high-performance packaging for the AI era.
- SAphire™: A family of copper nanopaste built on Elephantech’s proprietary Self-Assembling Copper Nanoparticle technology. It enables high bonding strength and low resistivity for applications of die attach, TIM, TGV filling and inter-board connections in ultra-high-layer PCBs.
By leveraging these technologies, Elephantech will help accelerate development of innovative manufacturing paradigms in advanced packaging, addressing key challenges in the evolution of AI hardware, including interconnect density, thermal management, manufacturability and long-term reliability. The company seeks to contribute to setting industry best practices and the technological foundations to support future semiconductor ecosystems.