Elephantech Joins the 27th International Conference on Electronic Packaging Technology (ICEPT)

Elephantech will participate in the 27th International Conference on Electronic Packaging Technology (ICEPT) in Xi’an, China, and engage with experts and industry professionals across the electronics packaging field at Poster Session B.

At the conference, Elephantech will showcase its advanced SAphire™ family of nano copperpastes. Built on the company’s proprietary Self-Assembling Copper Nanoparticle (SA-CuNP) technology, the SAphire™ series enables low-temperature, pressureless sintering with minimal amount of copper nanoparticle content, achieving high bonding strength and low electrical resistivity while significantly expanding process flexibility. It also provides a promising alternative solution to the conventional silver-based pastes with a huge cost advantage.

The SAphire™ portfolio delivers a wide range of applications including die attach, thermal interface materials (TIM), TGV filling, and inter-bord connections for ultra-high-layer-count PCBs, contributing to improved power semiconductor performance and advancement of next generation packaging technologies.

We look forward to connecting with industry peers and exploring potential collaborations at ICEPT.

大象科技将参展第 27 届电子封装技术国际会议

日本深科技企业大象科技股份有限公司将出席于中国西安市举办的第 27 届电子封装技术国际会议 (ICEPT)，并于8月7日在 Poster Session B 与电子封装领域的专家及业界同仁展开交流。

大象科技将重点展示其先进的纳米铜浆 SAphire™ 系列产品。这一系列运用该公司自研的铜纳米粒子自组装 (SA-CuNP) 技术，仅需极低比例的铜纳米粒子含量即可实现低温、无压烧结，高接合强度和低电阻率的同时，显著拓宽工艺窗口，并凭借巨大的成本优势成为传统银浆的有力替代方案。

SAphire™ 系列可广泛应用于芯片贴装、热界面材料 (TIM)、TGV 金属填充和超高层 PCB 层间连接等领域，推动功率半导体性能提升，助力先进封装技术的进一步发展。

期待在 ICEPT 现场与电子封装产业链的各位同行对话，探讨合作机会。