News
"Technical articles"
We will provide information from various angles, focusing on Elephantech’s manufacturing, development, and other technical information.
Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die Attach
Low-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles
Elephantech Inc. today announced the successful development of SAphire™ D, a low-temperature sintering copper nanopaste, based on its proprietary Self-Assembling Copper Nanoparticles (SA-CuNP) technology. The new paste is designed for next-generation power semiconductor die attach process.
Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –
Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
Elephantech Launches Copper-on-Copper Self-Assembling Nanoparticles
– Unlocking New Possibilities in Semiconductor Packaging Materials –
Elephantech announced the successful development of Self-Assembling Copper Nanoparticles, a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.
【Advantages of Using P-Flex®】Increase the frequency response of MEMS microphones with flexible substrates
MEMS microphones are used in various electronic devices including smartphones because of their small size and suitability for mass production. Most of them are surface-mount type and are mounted on PCBs.