News
"Technical articles"
We will provide information from various angles, focusing on Elephantech’s manufacturing, development, and other technical information.
Elephantech Unveils HDI Microvia Formation Process Using Copper Nanoparticle Ink
– A Novel Solution for High-Density Board Manufacturing –
Elephantech announced successful development of an innovative process to form High-Density Interconnect microvia leveraging the company’s copper nanoparticle ink, named “Cu Nano Direct Plating.”
Elephantech Launches Copper-on-Copper Self-Assembled Nanoparticles
– Unlocking New Possibilities in Semiconductor Packaging Materials –
Elephantech announced the successful development of Self-Assembled Copper Nanoparticles, a breakthrough technology that imparts dispersibility to copper microparticle pastes through an entirely new mechanism.
【Advantages of Using P-Flex®】Increase the frequency response of MEMS microphones with flexible substrates
MEMS microphones are used in various electronic devices including smartphones because of their small size and suitability for mass production. Most of them are surface-mount type and are mounted on PCBs.