High-aspect-ratio HDI microvia formation DK100
An inkjet printing model designed for seed layer formation in high-aspect-ratio HDI microvias. As a key component of the DeepVia™ HDI solution, it enables material placement within deep vias, supporting reliable metallization in challenging structures.
Features
- High-precision inkjet controllability for accurate droplet placement in high-aspect-ratio microvias.
- Optimized compatibility with Elephantech's self-spreading copper nanoink to ensure uniform seed layer formation across the via surface.
- Direct ink delivery into deeper regions of the via, overcoming transport limitations of conventional solution-based processes.
Specifications
| Model | DK100 |
|---|---|
| Max. Panel Size | 550 x 622 mm |
| Stage Speed | 267 mm/sec |
| Stage Accuracy | Accuracy ±20 μm, Precision ±5 μm |
| Printhead | EPSON PrecisionCore D3000-U1R |
| Ink Types | Elephantech proprietary copper nanoink NCT-05 |
Applications
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High-aspect-ratio HDI microvia formation