Elephantech's Gen 4 inkjet printing platform ELP04
Elephantech's Gen 4 inkjet printing platform
The ELP04 is the world's most accurate and productive inkjet solution, powered by our proprietary NeuralJet™ AI technology.
It features a high-precision stage control function for exceptional impact repeatability and a droplet position control system utilizing NeuralJet™, enabling highly precise mass production processes.
Key Technological Features:
Feature 1AI-assisted High Precision
NeuralJet™, Elphantech’s proprietary AI model, learns and compensates for nozzle and printer errors, ensuring unparalleled accuracy.
Feature 2Production Proven
The ELP04 is equipped with mass production capabilities rooted in years of experience and expertise.
Feature 3Modularized Printer Design
A highly customizable modular printing platform that can be optimized for different product specifications.
ELP04 overview
Applications of the ELP04 printing platform
■ Wiring Cu seed layer printing
■ TGV
・ dielectric layer
・ Via Cu and seed layer
■ Solder resist printing
(high-density / solder dam)
■ Packaging layer formation
(adhesive, dielectric,
passivation, photoresist,
release layer, etc.)
■ Flux printing
■ Packaging marking
■ Quantum dot (QD) layer
formation
■ OLED layer formation
■ Perovskite layer formation
■ Electrode formation
■ Encapsulation layer
formation
ELP04-PILOT
The ELP04-PILOT represents the cutting edge of AI-assisted inkjet printer systems for lab and small production. At the core of the ELP04-PILOT lies NeuralJet™, Elephantech's proprietary AI system with proven performance in mass production environments. This advanced artificial intelligence drives the system's exceptional printing precision and accuracy. In addition, an ink ejection observation unit comes as standard equipment, making it easy to observe ink ejection. These key features help transform your manufacturing processes and material development.
ELP04-PCB
The result of years of experience and expertise in printed circuit board production, the ELP04-PCB is an industrial inkjet printer that enables both high precision output and excellent productivity.
Key features of the system include a design based on a large granite surface plate for precise mechanical construction and a printhead array with a long nozzle approximately 600 mm wide. With these specifications, it can print an 830 mm long workpiece in approximately 6.2 seconds per pass. In Elephantech's PCB mass production process, the system is expected to print a 500 mm × 830 mm sheet in about 31 seconds (assuming 5 passes), achieving a productivity of approximately 30 m²/hour.
This high-performance system offers the next generation of printing solutions by combining precision printing with high production efficiency. Additionally, the ELP04-PCB is a modular printing platform that can be customized to meet specific requirements. By combining these modules, a scalable printing system can be built, enabling applications beyond PCB manufacturing, such as semiconductor back-end processes and display production. This provides a versatile printing platform capable of addressing a wide range of needs.
Guide to Implementing Successful Inkjet Printing Solutions
Process and system development is critical for optimizing inkjet printing technology through the systematic fine-tuning of key parameters such as ink formulation, substrate-ink interactions and raster image processor.
Our comprehensive inkjet process development service is designed to optimize your printing technology and deliver superior results. We offer tailored solutions that enhance print quality, improve system reliability, and streamline your production processes.
Our core competencies
1. Advanced ink formulation:
Leveraging our expertise in Cu nano ink development for our product, we can assist in creating tailored ink formulations to meet your specific needs.
2. Comprehensive System Development:
We recognize the importance of the entire printing process, including automated loading and unloading systems and developing post-printing treatments such as UV curing.
Typical inkjet development process
ELP04 specifications
| Feature | ELP04-PILOT | ELP04-PCB |
| Application | Small production and lab | PCB mass production |
| Max. substrate size | 300 x 300 mm | 500 × 830 mm |
| Max. substrate thickness | 50 mm | 5 mm |
| Print speed | Up to 1,000 mm/s | Up to 1,000 mm/s |
| Drop placement | σ1 μm | σ1 μm |
| Head types | Epson PrecisionCore (D3000/S3200) | Epson PrecisionCore (D3000/S3200) |
| Head wipe | Optional - spitting and wiping | Optional - spitting and wiping |
| Ink types | Aqueous/UV/Solvent | Aqueous/UV/Solvent |
| Ink viscosity | 5-10 cps | 5-10 cps |
| Footprint (W x D x H) | 1,600(W) x 2,000(D) x 2,000(H) mm | 5,800(W) x 5,800(D) x 2,800(H) mm |
| AI Learning system | Easy and self-learning with user friendly interface | Easy and self-learning with user friendly interface |
| Measurement unit for AI learning | Inline optical measurement unit | Inline optical measurement unit |
| Alignment camera / mechanism | AI-based self-alignment | AI-based self-alignment |
| Vision systems | Pattern inspection | Pattern inspection |
| Integrated post processing | Available options: stage heater, UV pinning, UV curing and others | Hot air dryer, Stage heater, Photo sintering |