News

Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

Download April 22, 2025, Tokyo, Japan – Japanese deep-tech innovator Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon Printed Circuits Board (PCB) manufacturing. As the first milestone of the new direction, Elephantech has signed its second Memorandum of Understanding (MoU) with Taiwan-based LITE-ON Technology Corporation (LITEON), deepening their strategic partnership in advancing environmentally responsibl...

Elephantech and Logitech Together Drive Disruptive Electronics Innovation

Elephantech announced a groundbreaking collaboration with Logitech International to revolutionize peripherals manufacturing and the PCB industry.

[Media Coverage] PCB007: Elephantech: For a Greener Tomorrow

Elephantech was featured in PCB007 with an article titled “Elephantech: For a Greener Tomorrow.” Media Coverage List of Media Articles

Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production

Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.

Golden Week Holiday Announcement

We would like to inform you of Elephantech’s Golden Week holiday schedule.

Elephantech to Sponsor and Exhibit at ICEP 2025

Through our sponsorship, we aim to actively support academic and technical discussions in electronics packaging and contribute to the advancement of sustainable electronic device manufacturing.

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025 from March 24 to 26, 2025.

Elephantech will exhibit at IPC APEX EXPO 2025

Elephantech will be exhibiting at IPC APEX EXPO 2025 in Anaheim, USA, March 18-20, 2025.

Elephantech will exhibit at MWC 2025

Elephantech will participate in MWC 2025, which will be held in Barcelona, Spain, from Monday, March 3 to Thursday, March 6, 2025, for four days.

[Media Coverage]DIGITIMES asia：AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors

Elephantech was featured in DIGITIMES Asia with an article titled “AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors.”

[Media Coverage] Press Release : Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology.

Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

We are pleased to announce that, due to several technological innovations, we have successfully developed general-purpose multilayer PCBs earlier than expected.

Developed adhesive coating technology for advanced packaging using high-precision inkjet technology

Elephantech has introduced an inkjet-based method for applying bonding materials essential for advanced packaging, such as those used in AI semiconductors.

FLEX Japan 2024 : Announcement of presentation

Our company’s co-founder, Masaaki Sugimoto, will be speaking at FLEX Japan 2024, held alongside SEMICON Japan 2024. We hope to see you there.

Exhibition at SEMICON Japan 2024

Elephantech will be exhibiting at SEMICON Japan 2024, which will be held at the Tokyo Big Sight from Wednesday, December 11 to Friday, December 13, 2024. SEMICON Japan 2024 Exhibition Information Exhibition SEMICON Japan 2024 Dates Wednesday, December 11 to Friday, December 13, 2024. Venue Tokyo Big Sight ( Access ) Booth Booth: 2028 Exhibitor Page EXHIBITOR DETAILS Elephantech’s inkjet technology Elephantech provides high-precision, high-productivity inkjet solutions through its 4th gener...

Climate Hive Connect with Elephantech

At Climate Hive Connect, Satoshi Konagai, COO of Elephantech, delivered a presentation on the company’s groundbreaking sustainable printed circuit boards (PCBs).

TechBlick: Printed Electronics as sustainable solutions

A portion (the first five minutes) of our Board Director & Co-Founder Masaaki Sugimoto’s presentation at TechBlick has been released.

Elephantech will exhibit at electronica 2024.

Elephantech will be exhibiting at PCB West 2024, which will be held on Wednesday, October 9, 2024 at the Santa Clara Convention Center, CA USA. Don't miss to see Elephantech technology, please visit our booth!

Elephantech will exhibit at PCB WEST 2024.

Elephantech will be exhibiting at PCB West 2024, which will be held on Wednesday, October 9, 2024 at the Santa Clara Convention Center, CA USA. Don't miss to see Elephantech technology, please visit our booth!

Elephantech will exhibit at CEATEC 2024.

Elephantech will be exhibiting at CEATEC 2024, which will be held at the Makuhari Messe from Tuesday, October 15 to Friday, October 18, 2024. We provide the world’s highest level of high-precision, high-productivity inkjet solutions using our unique NeuralJet™ AI technology. At our booth, we will also provide information on the ELP04, a fourth-generation printer that enables process evolution in semiconductor packaging and FPD manufacturing through high-precision, uniform thin-film c...