News
Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON
Elephantech has officially launched its SustainaCircuits multilayer solutions, offering both equipment and materials to enable low-carbon printed circuit board manufacturing.
Elephantech Innovates Cost- and Eco-efficient SustainaCircuits™ FPC Lineup to Include Cu-foil Thickness Less Than 1 μm and Over 100 μm, Now in Mass Production
Elephantech expands its proprietary printed circuit boards lineup, SustainaCircuits™ by introducing new FPCs, now in mass production. The new FPCs feature copper foils with thicknesses under 1μm and over 100μm.
[Media Coverage] Press Release : Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology
Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology.