News

SustainaCircuits FPC Adopted for Mass Production in OM Digital Solutions’ Interchangeable Lens

Elephantech Inc. is pleased to announce that its proprietary flexible printed circuits have been adopted for mass production by OM Digital Solutions Corporation in the company’s latest flagship products.

Elephantech Selected as Inaugural Member of the Amazon Devices Climate Tech Accelerator 2025

Elephantech is honored to announce its selection as an inaugural member of the Amazon Devices Climate Tech Accelerator 2025.

【Exhibition】Elephantech to exhibit at Global Startup EXPO 2025

Elephantech will be exhibiting at Global Startup EXPO 2025, held September 17-18, 2025 at the Osaka-Kansai Expo MESSE “WASSE”.

【Exhibition】Announcement: Exhibiting at the 4^th NEPCON JAPAN [September]

Elephantech will be exhibiting at the 4th NEPCON JAPAN [Autumn], taking place September 17–19, 2025. At the event, we will showcase the capabilities of our world-class copper nanofiller to global electronics, semiconductor and automotive manufacturers.

[Media Coverage] Press Release : Elephantech Launches World’s Smallest-Class Copper Nanofiller

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches World’s Smallest-Class Copper Nanofiller.

We Awarded “Venture and SME Award” in the 24th GSC Awards

Elephantech has been honored with the “Venture and Small-to-Medium Enterprise Award” at the 24th Green & Sustainable Chemistry (GSC) Awards, organized by JACI.

[Video Release Announcement] Elephantech Flexible PCBs: AI-controlled copper inkjet printing for sustainable electronics future

An interview with Elephantech, recorded at Display Week 2025, is now available on YouTube. This video, titled “Elephantech flexible PCBs & AI-controlled copper inkjet printing for sustainable electronics future,” features Nobuhiko Okamoto, our Global Sales and Marketing Manager. He discusses our proprietary PCB manufacturing technology, “SustainaCircuits,” which significantly reduces environmental impact. In the interview, Mr. Okamoto details the technological advantages over co […]

Media Coverage: Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Launches SustainaCircuits Multilayer Solutions with Equipment and Material Provision, Signs Second MoU with LITEON.

[Media Coverage]Elephantech and Logitech Together Drive Disruptive Electronics Innovation

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech and Logitech Together Drive Disruptive Electronics Innovation.

Elephantech will be exhibiting at Automotive Engineering Exposition 2025 YOKOHAMA

Elephantech will be exhibiting at the Automotive Engineering Exposition 2025 YOKOHAMA from May 21 to May 23, 2025.

[Media Coverage] PCB007: Elephantech: For a Greener Tomorrow

Elephantech was featured in PCB007 with an article titled “Elephantech: For a Greener Tomorrow.” Media Coverage List of Media Articles

Golden Week Holiday Announcement

We would like to inform you of Elephantech’s Golden Week holiday schedule.

Elephantech to Sponsor and Exhibit at ICEP 2025

Through our sponsorship, we aim to actively support academic and technical discussions in electronics packaging and contribute to the advancement of sustainable electronic device manufacturing.

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025

Elephantech will exhibit at the International Electronic Circuits (Shanghai) Exhibition 2025 from March 24 to 26, 2025.

Elephantech will exhibit at IPC APEX EXPO 2025

Elephantech will be exhibiting at IPC APEX EXPO 2025 in Anaheim, USA, March 18-20, 2025.

Elephantech will exhibit at MWC 2025

Elephantech will participate in MWC 2025, which will be held in Barcelona, Spain, from Monday, March 3 to Thursday, March 6, 2025, for four days.

[Media Coverage]DIGITIMES asia：AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors

Elephantech was featured in DIGITIMES Asia with an article titled “AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors.”

[Media Coverage] Press Release : Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology

Press Release: We are pleased to share a summary of the media coverage for our announcement that Elephantech Unveils General-Purpose Multilayer PCBs With SustainaCircuits™ Technology.

Developed adhesive coating technology for advanced packaging using high-precision inkjet technology

Elephantech has introduced an inkjet-based method for applying bonding materials essential for advanced packaging, such as those used in AI semiconductors.

FLEX Japan 2024 : Announcement of presentation

Our company’s co-founder, Masaaki Sugimoto, will be speaking at FLEX Japan 2024, held alongside SEMICON Japan 2024. We hope to see you there.