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Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech Has Developed Copper Nano-Paste
SAphire™ G for Glass Vias in Advanced PackagingLow-Shrinkage and Robust Metallization for High-AR TGVs

Elephantech Develops DeepVia™ Silicon: A High-Aspect-Ratio Seed Layer Solution for 3D Semiconductor IntegrationA Novel Approach for Silicon Via Seed Layer Formation Addressing Increasing Aspect Ratios

May, 2026

NEW!

Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech announces the development of SAphire™ D02, a new addition to its SAphire™ low-temperature sintering copper nano-paste lineup, designed for pressureless die attach applications.

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