SEMICON TAIWAN, organized by SEMI (Semiconductor Equipment and Materials International), is a platform that connects Taiwan’s semiconductor ecosystem with the global microelectronics industry, bringing together companies, government, academia, and research institutions.
| Event | SEMICON TAIWAN 2026 |
| Dates | September 2 (Wed) – 4 (Fri), 2026 |
| Venue | TaiNEX (Taipei Nangang Exhibition Center), Taipei, Taiwan |
| Booth | Booth No. T9404, 7F, TaiNEX 2 (Silicon Startups Zone) |
- Nano Copper Deposition:
Achieves sufficient seed layer coverage in high-aspect-ratio vias to overcome the limitations of conventional electroless copper plating approaches. The inkjet-based copper nano-ink selective deposition enables formation or augmentation of seed layer only where needed. Its portfolio includes DeepVia™ HDI, addressing challenges via geometry of AR > 4.0 and DS-SAP™, supporting continuous via seed-layer and thin trace seed layer in package substrates.
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SAphire™ Family of Copper Nanopastes:
The SAphire™ family enables low-temperature, pressureless sintering while maintaining high bonding strength across various applications. The highlights are SAphire™ G, for through-glass via (TGV) filling in glass-core substrates, and SAphire™ B, designed for connecting modules of super-high-layer PCBs.
Elephantech will present at the Silicon Startups Stage.
| Date & Time | September 2 (Wed), 2026, 15:20–15:30 (local time) |
| Topic | Nanotechnology for Next-Generation Semiconductor Packaging and AI Infrastructure |
| Session | Session 3 – Advanced Packaging, Chiplets & Heterogeneous Integration |
| Speaker | Nobuhiko Okamoto | Global Marketing, Elephantech Inc. |
Through our exhibition and presentation, we look forward to engaging in in-depth discussions with foundries, substrate manufacturers, OSATs and other industry partners across the Greater China region.