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Elephantech Has Developed SAphire™ B: A Low-Resistance Copper Nanopaste for Inter-Board Connections in High-Layer-Count PCBsAchieves High Reliability Through Low-Temperature Sintering in Ambient Atmosphere

Elephantech Introduces DS-SAP™ for Fine Patterning on Semiconductor Package SubstratesDual-Seed Technology Enables Higher Density for Advanced AI Packaging

Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

"Events"

Introduction to announcements about events and exhibitions

On February 15 and 16, Elephantech co-founder, CEO and CTO Shimizu will be a speaker at the ITB 2023 Sustainability Conference in Michigan, USA.

Elephantech’s co-founder, CEO, and CTO, Shimizu, will be speaking at the ITB 2023 Sustainability Conference in Michigan, USA on February 15th and 16th.

Notice of Booth Exhibit at SEMICON Japan2022 FLEX Japan

Elephantech, Inc. will be exhibiting at the SEMICON Japan2022 FLEX Japan booth at the Tokyo Big Sight site from December 14, 2022 (Wed) to December 16, 2021 (Fri), 10:00-17:00.

masaaki-sugimoto

Elephantech cofounder and SVP Masaaki Sugimoto talk was featured on TechBlick’s Youtube channel!

Elephantech cofounder and SVP Masaaki Sugimoto talk was featured on TechBlick’s Youtube channel!

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