News

Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech announces the development of SAphire™ D02, a new addition to its SAphire™ low-temperature sintering copper nano-paste lineup, designed for pressureless die attach applications.

Elephantech Has Developed Copper Nano-Paste
SAphire™ G for Glass Vias in Advanced PackagingLow-Shrinkage and Robust Metallization for High-AR TGVs

Elephantech Inc. has developed "SAphire™ G," a copper nano-paste for Through-Glass Via (TGV) filling, utilizing its proprietary Self-Assembling Copper Nanoparticle (SA-CuNP) technology.

Elephantech Develops DeepVia™ Silicon: A High-Aspect-Ratio Seed Layer Solution for 3D Semiconductor IntegrationA Novel Approach for Silicon Via Seed Layer Formation Addressing Increasing Aspect Ratios

Elephantech has developed a novel approach for forming copper seed layers in high-aspect-ratio (AR) silicon vias, utilizing proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3 : 1 to Advance AI computing

Elephantech announced the successful development of DeepVia™ HDI, a high-aspect-ratio microvia metallization solution based on its proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech to Present at SusHi Tech Tokyo 2026

Elephantech will present at SusHi Tech Tokyo 2026 on Tuesday, April 28, 2026.

Elephantech is to Sponsor and Exhibit at ICEP 2026

Elephantech Inc. will join the International Conference on Electronics Packaging (ICEP) 2026, hosted by the Japan Institute of Electronics Packaging (JIEP), held in Hiroshima from April 14 to 18.

Elephantech Selected for NEDO’s “GX Startup-Large Enterprise Collaboration and Funding Acceleration Program”

Elephantech Inc. is pleased to announce its selection for the “GX Sector Startup-Large Enterprise Collaboration and Funding Acceleration Program, Proof of Product Phase under Co-Creation Themes (GX_PoP Phase)”, conducted by the New Energy and Industrial Technology Development Organization (NEDO).

Elephantech Has Developed SAphire™ D, a Copper Sintering Paste for Power Semiconductor Die AttachLow-Temperature Sintering Copper Nanopaste Enabled by Self-Assembling Copper Nanoparticles

Elephantech Inc. today announced the successful development of SAphire™ D, a low-temperature sintering copper nanopaste, based on its proprietary Self-Assembling Copper Nanoparticles (SA-CuNP) technology. The new paste is designed for next-generation power semiconductor die attach process.

Elephantech Announces Investment from Mitsubishi Electric and Strategic Partnership to Accelerate Global Deployment of SustainaCircuits

Elephantech has secured a JPY 4 billion investment from Mitsubishi Electric and entered into a strategic partnership.

We Are to Exhibit at Global Industrie Paris 2026

Elephantech will join Global Industrie Paris 2026, one of Europe’s leading manufacturing exhibitions, held in Paris, France, from March 30 to April 2, 2026.

Visit us at IPC APEX Expo 2026!

Elephantech will be exhibiting at IPC APEX EXPO 2026, to be held at the Anaheim Convention Center in California, USA, from March 17 (Tue) through March 19 (Thu) 2026.

Sumitronics Corporation Announces Implementation of Elephantech’s Inkjet Printing System

Sumitronics Corporation has issued a press release regarding the introduction of Elephantech’s advanced inkjet printing equipment, ELP04 PILOT 600R.

Visit Us at the 40th NEPCON Japan!

Elephantech will be exhibiting at NEPCON Japan 2026, held January 21–23 at Tokyo Big Sight, at the Sumitronics booth.