ニュース News

Elephantech to Open Toyosu Advanced Packaging Center Accelerating Manufacturing Scale-Up and Technology Adoption for Next-Generation AI Hardware

Elephantech Inc. announces plans to commence operations at its new Toyosu Advanced Packaging Center (Toyosu APC) in March 2027.

Elephantech to Join IMPACT-IAAC 2026 and TPCA Show 2026CEO Shinya Shimizu to Present on Advanced Vertical Interconnect Technologies

Elephantech will participate in IMPACT-IAAC 2026 and TPCA Show 2026 in Taipei, Taiwan, in October 2026.

Elephantech to Exhibit at Japan Mobility Show Bizweek 2026

Elephantech will exhibit at Japan Mobility Show Bizweek 2026, taking place at Makuhari Messe, Japan, from October 13 to 16, 2026.

Elephantech CEO Shinya Shimizu to Speak at “Impact Challenge of the year 2026”

Elephantech CEO Shinya Shimizu will speak at Forbes Impact Challenge of the Year 2026 on October 7, sharing the company’s progress and future outlook.

Elephantech Ships First DK100 Manufacturing System for Next-Generation AI Server PCBsOverseas Shipment Within Five Months of Technology Debut for On-Site Installation

Elephantech shipped its DK100 inkjet printing system overseas for the first time to a PCB manufacturer. DK100 supports DeepVia™ HDI for AI server boards.

Elephantech to Speak at PCB West 2026

On Tuesday, September 29, 2026, Takuro Sakamoto, Executive Officer, Head of Customer Development at Elephantech, will serve as a panelist at PCB West 2026, held in Santa Clara, California.

Elephantech to Exhibit at SEMICON TAIWAN 2026

Elephantech will exhibit at SEMICON TAIWAN 2026, taking place in Taipei, Taiwan, from September 2 to 4, 2026.

Elephantech to Exhibit at PCIM Asia Shenzhen 2026

Elephantech will exhibit at PCIM Asia Shenzhen 2026, taking place in Shenzhen, China, from August 26 to 28, 2026.

Elephantech Joins the 27th International Conference on Electronic Packaging Technology (ICEPT)

Elephantech will participate in the 27th International Conference on Electronic Packaging Technology (ICEPT) in Xi'an, China, and engage with experts and industry professionals across the electronics packaging field at Poster Session B.

Elephantech Joins UCLA CHIPS

Elephantech has joined the Center for Heterogeneous Integration and Performance Scaling (CHIPS), a university-industry consortium at the University of California, Los Angeles (UCLA).

Join Elephantech CEO Shinya Shimizu at an IEEE Webinar

On August 6, 2026(PT), Shinya Shimizu, Founder and CEO of Elephantech, will present at a webinar hosted by the IEEE Electronics Packaging Society (EPS) Santa Clara Valley Chapter, an IEEE chapter dedicated to electronics packaging and assembly technologies.

Elephantech Has Developed SAphire™ B: A Low-Resistance Copper Nanopaste for Inter-Board Connections in High-Layer-Count PCBsAchieves High Reliability Through Low-Temperature Sintering in Ambient Atmosphere

Elephantech announced SAphire™ B, a copper nanopaste designed for inter-board connections in advanced multilayer PCBs.

Elephantech Introduces DS-SAP™ for Fine Patterning on Semiconductor Package SubstratesDual-Seed Technology Enables Higher Density for Advanced AI Packaging

Elephantech has developed DS-SAP™, a novel process for semiconductor package substrates manufacturing. Through independently forming seed layers for surface patterning and via metallization, DS-SAP™ achieves both ultra-thin traces and reliable coverage of high-aspect-ratio vias.

Exhibiting at JPCA Show 2026

Elephantech will be exhibiting at JPCA Show 2026, one of Asia’s leading international exhibitions for the electronics industry. In addition to our own booth, we will also participate in a joint exhibition with our business partner Mitsubishi Electric.

Elephantech Has Developed SAphire™ D02, A Copper Nano-paste for Pressureless Die Attach in Power SemiconductorsAdvancement of its Low-Temperature Sintering Technology Enables Greater Process Flexibility

Elephantech announces the development of SAphire™ D02, a new addition to its SAphire™ low-temperature sintering copper nano-paste lineup, designed for pressureless die attach applications.

Elephantech Has Developed Copper Nano-Paste
SAphire™ G for Glass Vias in Advanced PackagingLow-Shrinkage and Robust Metallization for High-AR TGVs

Elephantech Inc. has developed "SAphire™ G," a copper nano-paste for Through-Glass Via (TGV) filling, utilizing its proprietary Self-Assembling Copper Nanoparticle (SA-CuNP) technology.

Elephantech Develops DeepVia™ Silicon: A High-Aspect-Ratio Seed Layer Solution for 3D Semiconductor IntegrationA Novel Approach for Silicon Via Seed Layer Formation Addressing Increasing Aspect Ratios

Elephantech has developed a novel approach for forming copper seed layers in high-aspect-ratio (AR) silicon vias, utilizing proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech Has Developed DeepVia™ HDI Solution for High-Aspect-Ratio Microvia MetallizationEnabling Very High AR ≥ 3 : 1 to Advance AI computing

Elephantech announced the successful development of DeepVia™ HDI, a high-aspect-ratio microvia metallization solution based on its proprietary copper nanoparticle ink and inkjet printing equipment.

Elephantech to Present at SusHi Tech Tokyo 2026

Elephantech will present at SusHi Tech Tokyo 2026 on Tuesday, April 28, 2026.

Elephantech is to Sponsor and Exhibit at ICEP 2026

Elephantech Inc. will join the International Conference on Electronics Packaging (ICEP) 2026, hosted by the Japan Institute of Electronics Packaging (JIEP), held in Hiroshima from April 14 to 18.