Elephantech will participate in IMPACT-IAAC 2026 and TPCA Show 2026 in Taipei, Taiwan, in October 2026.
On October 20, Shinya Shimizu, CEO and Founder of Elephantech, will also present at IMPACT-IAAC 2026, an international technical conference, to introduce our solutions that enable new design rules for next-generation substrates.
Organized by the Taiwan Printed Circuit Association (TPCA), TPCA Show is an international exhibition for the electronics industry with a focus on printed circuit boards (PCBs). The event covers a wide range of technologies and solutions, including PCB manufacturing, AI, advanced packaging, and green technologies.
Elephantech will showcase our latest advanced substrate manufacturing technology with application samples at the booth of SHINBU CORPORATION, our business partner in Taiwan.
| Event | IMPACT-IAAC 2026 |
| Date & Time | October 20, 2026, 1:00–1:30 PM (local time) |
| Venue | 703, 7F, TaiNEX 2 |
| Presentation | Advanced Vertical Interconnects Utilizing Copper Nanomaterials |
| Speaker | Shinya Shimizu | President & CEO / Founder, Elephantech Inc. |
- Nano Copper Deposition
Nano Copper Deposition is Elephantech’s inkjet-based technology platform for selectively forming copper seed layers, enabling full coverage inside high-aspect-ratio vias where conventional electroless copper plating approaches face limitations. By precisely depositing copper nanoink only where needed, NCD creates continuous and conformal seed coverage for next-generation AI server boards. Featured solutions will include the DeepVia™ HDI solution designed for HDI boards and DS-SAP™ for package substrates.
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SAphire™ Copper Nanopaste
A sintering copper nanopaste family based on Elephantech’s proprietary Self-Assembling Copper Nanoparticle (SA-CuNP) technology. Products on display include SAphire™ D, featuring low-temperature sintering and high bonding strength for die attach and thermal interface material (TIM) applications, and SAphire™ G, engineered for TGV filling in glass core substrates.
| Event | IMPACT-IAAC 2026 |
| Display Dates | October 19–21, 2026 |
| Venue | October 19: Grand HiLai Taipei, 3F Crystal Ballroom |
| October 20: Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2), 7F, 701E | |
| October 21: Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2), 7F, 701E |
| Event | TPCA Show 2026 |
| Dates | October 20–22, 2026 |
| Venue | Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) |
| Booth | M-1117 (新武股份有限公司 / SHINBU CORPORATION) |
We look forward to seeing you in Taipei and discussing how Elephantech’s technologies can contribute to cutting-edge PCB design and advanced packaging.